rus
Issue #6/2019
D. Sukhanov, V. Komanov
Heterogeneous integration using chip to wafer batch bonding – an effective approach to 3D IC integration
Heterogeneous integration using chip to wafer batch bonding – an effective approach to 3D IC integration
The article considers the process of chip to wafer batch bonding. It is noted that this process provides high performance while keeping the complexity of wafer bonding equipment at an acceptable level and is universally suitable for established and advanced technologies of heterogeneous integration.
DOI: 10.22184/1992-4178.2019.187.6.162.167
DOI: 10.22184/1992-4178.2019.187.6.162.167
Heterogeneous integration using chip to wafer batch bonding – an effective approach to 3D IC integration
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