DOI: 10.22184/1992-4178.2022.

The article describes the problems that arise during wire interconnect high-speed mounting in multi-chip assemblies, in particular, in 2.5D structures with a large difference in height of bonding levels. The main characteristics of EM‑4520 ultrasonic bonding machine manufactured by “Planar-­SO”, the Belarusian company, and its bonding system are given.


Разработка: студия Green Art