rus
Issue #5/2022
I. Petukhov
AUTOMATIC WEDGE MOUNTING MACHINE FOR SMALL DIAMETER WIRE INTERCONNECTS IN 2.5D ELECTRONIC MODULES
AUTOMATIC WEDGE MOUNTING MACHINE FOR SMALL DIAMETER WIRE INTERCONNECTS IN 2.5D ELECTRONIC MODULES
DOI: 10.22184/1992-4178.2022.216.5.66.72
The article describes the problems that arise during wire interconnect high-speed mounting in multi-chip assemblies, in particular, in 2.5D structures with a large difference in height of bonding levels. The main characteristics of EM‑4520 ultrasonic bonding machine manufactured by “Planar-SO”, the Belarusian company, and its bonding system are given.
The article describes the problems that arise during wire interconnect high-speed mounting in multi-chip assemblies, in particular, in 2.5D structures with a large difference in height of bonding levels. The main characteristics of EM‑4520 ultrasonic bonding machine manufactured by “Planar-SO”, the Belarusian company, and its bonding system are given.
Теги: 5d-микросборки different heights of connection points em‑4520 machine geometry of bonding tool end multi-chip 2.5d microassemblies quality of bonding joints tool loading control tool position selection ultrasonic bonding vibration noise minimization wire interconnects выбор положения инструмента геометрия торца микросварочного инструмента качество микросварных соединений минимизация вибрационных шумов многокристальные 2 проволочные межсоединения разновысотность точек присоединения уз-микросварка управление нагружением инструмента установка эм‑4520
AUTOMATIC WEDGE MOUNTING MACHINE FOR SMALL DIAMETER WIRE INTERCONNECTS IN 2.5D ELECTRONIC MODULES
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