NINE HUNDRED PACKAGE TYPES OVER 45 YEARS VISIT TO PRODUCTION FACILITY OF JSC “PLANT OF SEMICONDUCTOR DEVICES” DOI: 10.22184/1992-4178.2021.209.8.40.50
THE KEY POINT IS NOT TO START THE EQUIPMENT, BUT TO ARRANGE THE PRODUCTION PROCESS VISIT TO BLOOD GLUCOSE METER CODE STRIP ASSEMBLING FLOOR OF “ELTA COMPANY” LTD. DOI: 10.22184/1992-4178.2021.209.8.52.58
OUR GOAL IS TO BECOME A WORLD-CLASS INDUSTRIAL ENGINEERING CENTER DOI: 10.22184/1992-4178.2021.209.8.14.21
FOR INNOVATIVE DEVELOPMENT, SYNERGY OF THE STATE, BUSINESS, SCIENCE AND EDUCATION IS NEEDED DOI: 10.22184/1992-4178.2021.209.8.22.25
SMP CONNECTORS WITH INCREASED VIBRATION AND SHOCK RESISTANCE DOI: 10.22184/1992-4178.2021.209.8.88.100
The article considers foreign SMP connectors with increased vibration and shock resistance. The key application of SMP connectors is complex multifunctional high-density microwave modules for aeronautical and aerospace systems, active phased arrays, radars and other special-purpose products.
RESISTORS – BASIC TYPES AND CHARACTERISTICS. Part 4 DOI: 10.22184/1992-4178.2021.209.8.102.113
The article considers the resistors of various types. The information on passive components of resistance for special purposes is provided.
IMPROVING THE ACCURACY OF ORIENTATION ANGLES DETECTION AT STRAPDOWN INERTIAL NAVIGATION SYSTEM DOI: 10.22184/1992-4178.2021.209.8.152.155
The article considers the method of SINS correction using the Kalman filter algorithm, the measurement vector of which is formed on the basis of the readings of the satellite navigation system (SNS) receiver. The method is simple to implement and improves the accuracy of the navigation solution.
HOW MEASURING THE ERROR VECTOR MAGNITUDE HELPS OPTIMIZE OVERALL SYSTEM PERFORMANCE DOI: 10.22184/1992-4178.2021.209.8.142.148
Error Vector Magnitude (EVM) is an important characteristic that allows you to quantify the combined impact of all the potential impairments in communication systems. The article analyzes what system parameters affect the EVM, considers a number of examples of using EVM to optimize device performance at the system level.
OPERATIONAL AMPLIFIER SPECIFICATIONS. HOW TO MEASURE AND WHAT ARE THE DIFFICULTIES? DOI: 10.22184/1992-4178.2021.209.8.114.128
The article analyzes the measurements of operational amplifiers characteristics. It is noted that the measurement design considered in the article do not require the creation of stands with expensive equipment and can be used by developers and radio fans when it is necessary to check the declared characteristics of the amplifier.
INTERFACE UNIT AND COMMUNICATION PROTOCOL FOR MEASURING SILICON SYSTEM DOI: 10.22184/1992-4178.2021.209.8.132.140
The article discusses the implementation features of interface unit and communication protocol for the readout electronics of silicon detectors in the projects of high-energy physics and physics of cosmic rays.
ADAPTIVE ENERGY-SAVING COMPLEX DOI: 10.22184/1992-4178.2021.209.8.62.68
The article discusses the adaptive energy-saving complex (ACES), which provides reactive power compensation. It is noted that, as shown AKES devices tests, their use at enterprises saves over 15% of active electricity.
POWER SEMICONDUCTORS AND THE FUTURE OF SiC TECHNOLOGY DOI: 10.22184/1992-4178.2021.209.8.70.79
Power semiconductor industry will develop steadily until 2025, demonstrating moderate growth rates in general, and very high in the most promising areas. The fastest growing segments are GaN and SiC technologies. Moreover more than half of SiC devices are consumed by the automotive industry.
INFINEON SMART POWER SWITCHES DOI: 10.22184/1992-4178.2021.209.8.80.83
Infineon offers the broadest portfolio of smart power switches on the market, featuring high reliability, advanced diagnostic and protection functions. The article provides an overview of the main families of Infineon smart power switches, their features and applications.
METAL-CERAMIC PACKAGES OF KT TYPE DOI: 10.22184/1992-4178.2021.209.8.84.86
The article presents new types of metal-ceramic packages for power integrated circuits, which meet the up-to-date microelectronics requirements. The packages have been developed and mastered in production at Semiconductor Devices Plant JSC of the Republic of Mari El.