rusReport from a company
Yu. Kovalevsky
Smart Systems Are Becoming a Part of Production Facilities alongside Equipment Visit to Assembly Facility of Ryazan Radioplant JSC
DOI: 10.22184/1992-4178.2020.194.3.64.71
Smart Systems Are Becoming a Part of Production Facilities alongside Equipment Visit to Assembly Facility of Ryazan Radioplant JSC
DOI: 10.22184/1992-4178.2020.194.3.64.71
Competent opinion
K. Saito
Electron Microscopes at Production Sites Ceased to Be Exotics Long Ago DOI: 10.22184/1992-4178.2020.194.3.12.18
Electron Microscopes at Production Sites Ceased to Be Exotics Long Ago DOI: 10.22184/1992-4178.2020.194.3.12.18
V. Bespalov, D. Sobyanin
Nowadays Siemens is the only company on the market that offers a comprehensive approach to digitalizing the development and manufacturing of both engineering and electronic products DOI: 10.22184/1992-4178.2020.194.3.20.26
Nowadays Siemens is the only company on the market that offers a comprehensive approach to digitalizing the development and manufacturing of both engineering and electronic products DOI: 10.22184/1992-4178.2020.194.3.20.26
D. Veleslavov
Our Contract Manufacturing Business Is Growing but We Are Seeking for Ideas to Enhance This Growth DOI: 10.22184/1992-4178.2020.194.3.28.30
Our Contract Manufacturing Business Is Growing but We Are Seeking for Ideas to Enhance This Growth DOI: 10.22184/1992-4178.2020.194.3.28.30
A. Sobolev
Russian contract manufacturing market through the eyes of one of its participants DOI: 10.22184/1992-4178.2020.194.3.32.36
Russian contract manufacturing market through the eyes of one of its participants DOI: 10.22184/1992-4178.2020.194.3.32.36
Column of radio-electronic industry department
NEWS
Company Profile
V. Kochemasov
«Radiocomp». Yesterday. Today. Tomorrow DOI: 10.22184/1992-4178.2020.194.3.72.74
«Radiocomp». Yesterday. Today. Tomorrow DOI: 10.22184/1992-4178.2020.194.3.72.74
Production Management
A. Solomatin
Industry 4.0 and modern service: features and trends The article considers modern approaches to providing after-sales service for industrial equipment. It reviews solutions proposed by Ostek-SMT.
DOI: 10.22184/1992-4178.2020.194.3.90.92
Industry 4.0 and modern service: features and trends The article considers modern approaches to providing after-sales service for industrial equipment. It reviews solutions proposed by Ostek-SMT.
DOI: 10.22184/1992-4178.2020.194.3.90.92
Electronic Components
D. Makhin, G. Morozova
Unified series of low voltage multilayer varistors DOI: 10.22184/1992-4178.2020.194.3.136.138
Unified series of low voltage multilayer varistors DOI: 10.22184/1992-4178.2020.194.3.136.138
F. Komissarov
Reliable MELF resistors from Firstohm DOI: 10.22184/1992-4178.2020.194.3.140.141
Reliable MELF resistors from Firstohm DOI: 10.22184/1992-4178.2020.194.3.140.141
A. Tsvetkov
New developments from PKK MILANDR JSC in the field of frequency oscillators DOI: 10.22184/1992-4178.2020.194.3.142.146
New developments from PKK MILANDR JSC in the field of frequency oscillators DOI: 10.22184/1992-4178.2020.194.3.142.146
Radio engineering systems
D. Chernyakovsky, A. Zinoviev, A. Mamaev, K. Yuriev, A. Novichkov, S. Zhukov, V. Kartsev
Implementation of PPP positioning mode in NTLab GNSS receivers DOI: 10.22184/1992-4178.2020.194.3.114.120
The article considers the implementation of PPP (Precise Point Positioning) positioning mode in NTLab GNSS receivers. It provides estimates of accuracy and convergence time of implemented PPP algorithms.
Implementation of PPP positioning mode in NTLab GNSS receivers DOI: 10.22184/1992-4178.2020.194.3.114.120
The article considers the implementation of PPP (Precise Point Positioning) positioning mode in NTLab GNSS receivers. It provides estimates of accuracy and convergence time of implemented PPP algorithms.
Test & Measurements
N. Lemeshko, A. Patshin
Evaluation of satellite navigators performance under interference using R&S SMW200A and R&S SMBV100B vector generators. Part 1 DOI: 10.22184/1992-4178.2020.194.3.122.125
The article considers the evaluation of satellite navigation receiver performance
under the presence of multipath reception, industrial radio interference as
well as signals carrying false navigation information using navigation signal
simulators based on R&S SMW200A and R&S SMBV100B vector generators from
Rohde & Schwarz.
Evaluation of satellite navigators performance under interference using R&S SMW200A and R&S SMBV100B vector generators. Part 1 DOI: 10.22184/1992-4178.2020.194.3.122.125
The article considers the evaluation of satellite navigation receiver performance
under the presence of multipath reception, industrial radio interference as
well as signals carrying false navigation information using navigation signal
simulators based on R&S SMW200A and R&S SMBV100B vector generators from
Rohde & Schwarz.
A. Mirskov, S. Shilyaev
On vibration diagnostics of technically complex industrial facilities DOI: 10.22184/1992-4178.2020.194.3.132.134
On vibration diagnostics of technically complex industrial facilities DOI: 10.22184/1992-4178.2020.194.3.132.134
CAD
A. Strogonov
Using Matlab / S imulink Altera DSP Builder to develop a FIR filter simulation model in parallel distributed arithmetic DOI: 10.22184/1992-4178.2020.194.3.176.187
Using Matlab / S imulink Altera DSP Builder to develop a FIR filter simulation model in parallel distributed arithmetic DOI: 10.22184/1992-4178.2020.194.3.176.187
Electromechanical components
S. Peskova
3M high speed edge connectors DOI: 10.22184/1992-4178.2020.194.3.148.150
3M high speed edge connectors DOI: 10.22184/1992-4178.2020.194.3.148.150
F. Komissarov
Fanhar Relays: High Quality at Competitive Prices DOI: 10.22184/1992-4178.2020.194.3.152.155
Fanhar Relays: High Quality at Competitive Prices DOI: 10.22184/1992-4178.2020.194.3.152.155
Production technologies
F. Barakovsky, S. Vantsov, F. Vasiliev
Spray method for PCB conductive pattern formation DOI: 10.22184/1992-4178.2020.194.3.108.112
The article describes the spray method of PCB metallization in a compact
installation, eliminating the need to use traditional galvanic lines. It presents
the results of a qualitative experiment carried out in laboratory environment and
possible installation scheme with closed circulation of process solutions.
Spray method for PCB conductive pattern formation DOI: 10.22184/1992-4178.2020.194.3.108.112
The article describes the spray method of PCB metallization in a compact
installation, eliminating the need to use traditional galvanic lines. It presents
the results of a qualitative experiment carried out in laboratory environment and
possible installation scheme with closed circulation of process solutions.
Tags: pcb metallization pcb metallization process automation spray metallization installation spray metallization method автоматизация процесса металлизации печатных плат металлизация печатных плат струйный метод металлизации установка струйной металлизации
Experts Opinoin
Chinese electronic components and the Russian market: specifics and opportunities
DOI: 10.22184/1992-4178.2020.194.3.58.63
Power electronics
V. Gromov, P. Yastrebov
5320 chips – the new series of switching voltage regulators DOI: 10.22184/1992-4178.2020.194.3.156.164
5320 chips – the new series of switching voltage regulators DOI: 10.22184/1992-4178.2020.194.3.156.164
V. Ezhov
MORNSUN QA 151 DC / DC converter application in power transistor gate control circuits for solar inverters DOI: 10.22184/1992-4178.2020.194.3.166.169
MORNSUN QA 151 DC / DC converter application in power transistor gate control circuits for solar inverters DOI: 10.22184/1992-4178.2020.194.3.166.169
A. Pavlov
TDK-Lambda GENESYS+ programmable power supplies: high power in a compact form-factor DOI: 10.22184/1992-4178.2020.194.3.170.174
TDK-Lambda GENESYS+ programmable power supplies: high power in a compact form-factor DOI: 10.22184/1992-4178.2020.194.3.170.174
Micro and nanostructures
M. Makushin, V. Martynov
Microelectronics manufacturing technologies: development challenges. Part 1 DOI: 10.22184/1992-4178.2020.194.3.76.88
The article considers the evolution of transistor structures, new classes of 2.5D and 3D modules, packaging techniques, as well as prospects for the development of chiplets for the US Department of defense and civilian products and standards.
Microelectronics manufacturing technologies: development challenges. Part 1 DOI: 10.22184/1992-4178.2020.194.3.76.88
The article considers the evolution of transistor structures, new classes of 2.5D and 3D modules, packaging techniques, as well as prospects for the development of chiplets for the US Department of defense and civilian products and standards.
Tags: 2 2.5d and 3d modules 5d- и 3d‑модули chiplets transistor structures транзисторные структуры чиплеты
Manufacturing equipment and process materials
A. Garanin
Surface-mount challenges and flexible Europlacer solutions DOI: 10.22184/1992-4178.2020.194.3.94.98
Surface-mount challenges and flexible Europlacer solutions DOI: 10.22184/1992-4178.2020.194.3.94.98
O. Kitaev
Cleaning and moisture protection processes in electronic production DOI: 10.22184/1992-4178.2020.194.3.100.107
Cleaning and moisture protection processes in electronic production DOI: 10.22184/1992-4178.2020.194.3.100.107