Smart Systems Are Becoming a Part of Production Facilities alongside Equipment Visit to Assembly Facility of Ryazan Radioplant JSC
Nowadays Siemens is the only company on the market that offers a comprehensive approach to digitalizing the development and manufacturing of both engineering and electronic products
Our Contract Manufacturing Business Is Growing but We Are Seeking for Ideas to Enhance This Growth
Industry 4.0 and modern service: features and trends The article considers modern approaches to providing after-sales service for industrial equipment. It reviews solutions proposed by Ostek-SMT.
Implementation of PPP positioning mode in NTLab GNSS receivers The article considers the implementation of PPP (Precise Point Positioning) positioning mode in NTLab GNSS receivers. It provides estimates of accuracy and convergence time of implemented PPP algorithms.
Evaluation of satellite navigators performance under interference using R&S SMW200A and R&S SMBV100B vector generators. Part 1 The article considers the evaluation of satellite navigation receiver performance
under the presence of multipath reception, industrial radio interference as
well as signals carrying false navigation information using navigation signal
simulators based on R&S SMW200A and R&S SMBV100B vector generators from
Rohde & Schwarz.
Shielded and anechoic chambers as alternative measuring platforms and information protection facilities
Using Matlab / S imulink Altera DSP Builder to develop a FIR filter simulation model in parallel distributed arithmetic
Spray method for PCB conductive pattern formation The article describes the spray method of PCB metallization in a compact
installation, eliminating the need to use traditional galvanic lines. It presents
the results of a qualitative experiment carried out in laboratory environment and
possible installation scheme with closed circulation of process solutions.
MORNSUN QA 151 DC / DC converter application in power transistor gate control circuits for solar inverters
Microelectronics manufacturing technologies: development challenges. Part 1 The article considers the evolution of transistor structures, new classes of 2.5D and 3D modules, packaging techniques, as well as prospects for the development of chiplets for the US Department of defense and civilian products and standards.