Digital Era Demands a New Legal Consciousness DOI: 10.22184/1992-4178.2019.187.6.12.16
For the future we see ourselves as a corporate center for PCB production Visit to Azov Optical and Mechanical Plant
How to Simplify Approval Procedures for Applicants When Creating And Utilising Electronic Components DOI: 10.22184/1992-4178.2019.187.6.52.55
“Multi-functional Center of Radio Electronics – an Industry One-stop Shop of Information”
the 3rd FSUE MNIIRIP Science and Technology Conference
Topical Considerations of EMC assurance DOI: 10.22184/1992-4178.2019.187.6.56.57
“Electromagnetic Compatibility” the 8th All-Russia Science and Technology Conference
How to create a digital production in electronic industry DOI: 10.22184/1992-4178.2019.187.6.58.60
Legal Regulation of Unmanned Vehicles DOI: 10.22184/1992-4178.2019.187.6.18.21
Joint Meeting Of the Section For the Military-Industrial Complex And the Task Group for State Air Forces And Aircraft Industry Regulatory Of the Expert Council Of the Committee For Defense And Security Of the Federation Council
External financing from the fund: Is it as difficult as it seems? DOI: 10.22184/1992-4178.2019.187.6.176.180
5G networks development aspects It is expected that new generation networks will become not just another stage in the development of wireless communication technologies but a breakthrough technology that can change the world around us — everyday life, production, entertainment, services, etc. In addition, 5G networks will contribute to the accelerated development of the Internet of things, edge computing and a number of other related technologies
SW and MW range communication system based on domestic electronic components The article considers the requirements for modern communications at Russian railways and describes hardware and software solutions for locomotive radio stations
Metal and dielectric processing in argon microwave plasma at atmospheric pressure The article presents the results of various material processing in argon microwave plasma, which were obtained using the equipment from Rudnev-Shilyaev LLC. It is noted that the conducted research shows the effectiveness of applying atmospheric pressure microwave plasma for surface processing before creating adhesive joints, as well as for processing samples before sintering in powder metallurgy.
Micro assembly packages from ZPP JSC DOI: 10.22184/1992-4178.2019.187.6.136.138
The article considers micro assembly packages from ZPP JSC. It is noted that today ZPP JSC has already developed and produces a number of micro assembly package sizes and intends to continue development in this field.
B33 domestic noise-suppression ceramic filters for surface mounting DOI: 10.22184/1992-4178.2019.187.6.120.127
B33 C-type noise suppressing ceramic filters for surface mounting was developed and mastered in production at "NII "Girikond" JSC on the basis of advanced ceramic materials, technologies and equipment. The article discusses the design, parameters and application of these devices.
Variable capacitors DOI: 10.22184/1992-4178.2019.187.6.128.135
The article considers variable capacitors. It provides data on main types of such devices, their characteristics and manufacturers.
Mentor, a Siemens Business solutions for IC and PCB design. Part 2 DOI: 10.22184/1992-4178.2019.187.6.140.148
The article provides brief information about all design tools from Mentor Graphics. The second part of the article presents the tools for the design and analysis of printed circuit boards.
Application of GTEM cell based flat field generators for radar measurements DOI: 10.22184/1992-4178.2019.187.6.80.83
The article proposes the method for measuring the radar cross section (RCS) of objects using GTEM test cells. It is noted that the advantage of the approach is the possibility of measuring RCS in the frequency range which is far below 0,5–1 GHz and not available for traditional measuring instruments.
Installation for measuring the amplitude-frequency response of microwave photodiodes DOI: 10.22184/1992-4178.2019.187.6.84.88
The domestic industry is mastering the production of high-power microwave photodiodes for use in radar systems and microwave measurement equipment. The article describes the installation developed at "MNIIRIP" FSUE for measuring the frequency response of microwave photodiodes in the range up to hundreds of GHz.
Issues and Options of V2X Testing DOI: 10.22184/1992-4178.2019.187.6.92.96
The article describes vehicle to external environment communication system tasks, overviews the current state of standardization in this area, lists the major features of C-V2X device testing, as well as Keysight Technologies’ solutions for this.
Finding the optimal balance between sampling and quantization for microwave ADC DOI: 10.22184/1992-4178.2019.187.6.72.74
The article discusses the approaches to choosing the optimal balance between sampling frequency and resolution of microwave range analog-to-digital converters (ADC). It provides the examples of signal processing by various ADCs.
Mini-Circuits’ Solutions: From Microwave Component Selection To Product Testing At Production Site DOI: 10.22184/1992-4178.2019.187.6.76.79
Identification of counterfeit products in microelectronics The volume of counterfeit in the microelectronic industry grows constantly, which is why electronics manufacturers lose tens of billions of dollars annually. The article describes the types of counterfeit products and the main methods of its detection.
Molten salt chlorination in a polycrystalline silicon production technology To reduce the cost of polysilicon materials containing silicon dioxide as a raw material are proposed to be used. The article describes the process of silica chlorination in a molten salt and the raw materials used. It determines the main raw materials usage, their cost in a traditional and proposed new polysilicon production technology. It provides the comparative analysis of calculated values.
Heterogeneous integration using chip to wafer batch bonding – an effective approach to 3D IC integration The article considers the process of chip to wafer batch bonding. It is noted that this process provides high performance while keeping the complexity of wafer bonding equipment at an acceptable level and is universally suitable for established and advanced technologies of heterogeneous integration.
The way of preventing the defects in printed circuit boards holes The article summarizes the results of studies covered in the journal during 2016-2018. Their practical effect is presented – the way to prevent the occurrence of defects in the inner surface of holes in printed circuit boards when they are drilled, suitable for introduction into automated production.