It’s time for us to create and develop enterprises instead of providing conditions for this
The development of radioelectronics is the basis of the digital economy of Russia cooperation between regions and enterprises
New norms in the sphere of state defense order and practice of their application
Digital world and reality: the edges of interaction The article considers the trends in the field of digital technologies: extended use of digital counterparts, moving of cloud technologies to edge computing, the development of dialog platforms and the multi-directional impact on user experience.
Global projects for the development of electronics and information and communication technologies: a threat and new opportunities for the development of the Russian economy The article considers the actuality of the issues disclosed in the article "Accelerated Development of microelectronics and ICT and the fourth industrial revolution" by O.B.Koshovets and N.A.Ganichev based on the analysis of the behavior of the world economy in recent years, those concepts and ideas that are considered as possible sources of new mechanisms for economic growth and threats and opportunities, which they bring for Russia.
Accelerated development of microelectronics and ICT and the fourth industrial revolution The authors consider the latest data on global technological development and investments in R&D within the context of emerging new digital revolution. They show that microelectronics and ICT remain a priority of technological development for most developed countries and large corporations. Based on the analysis of these trends and the background of ICT development throughout the 1990s – 2000s the authors conclude that "fourth industrial revolution" aim at further commercialization of the already going ICT by creating for them fundamentally new mass markets. That may lead to the formation of a new mechanism that enables transnational ICT corporations to maintain a monopoly position on the market and receive "technological rent".
Automation of management: audit of production Based on the experience in development and implementation of Manufactu¬ring Execution System (MES) at one of the St. Petersburg’s instrument-making enterprises the article considers the first stage of the process that is the audit of production, which is planned to be automated.
Simulation and advanced circuit analysis using PSpice 2017 The article considers the key features and extended capabilities of PSpice analog/analog-digital circuit simulator from Cadence as well as the benefits that the developer gets when using this tool.
Dynamics of memory circuits’ technologies and market development The article focuses on DRAM and flash memory’s market prospects, moving to 3D structures as well as market and technological factors for 3D NAND flash memory development.
Key aspects of the use of flash memory in embedded systems The article considers the most common types of flash memory and key challenges that the developer should take into account when creating an embedded application.
3D modules based on silicon backplanes The article considers three-dimensional (3D) systems in package (SiP) based on silicon backplanes. It is noted that the adoption of 3D SiP assembly technology is the necessary step on the way of creation of advanced types of multifunctional electronic devices.
Advanced metal-ceramic packages for electronic components from ZPP JSC The article reviews advanced types of metal-ceramic packages produced by ZPP JSC, including multi-lead array packages, such as BGA and CCGA, miniature lead-free packages as well as packages for multi-chips modules.
When the board is not the case. Recommendations for assembly line technologists Defects detected after assembled electronic devices’ inspection are often treated as a consequence of poor quality of printed circuit boards. This is incorrect in many cases. The article shows that the reasons for failures can be the faults in handling of PCBs and devices at the assembly line itself. Recommendations are given to reduce the probability of such failures to a minimum.
Solid-state microwave switches. Part 1 The article considers the general information about solid-state microwave switches and technologies used to create these devices. The features of switches manufactured on the basis of various technologies have been observed.
Implementation of at-line x-ray inspection systems at assembly line Yxlon offers a high-resolution X-ray inspection system adapted for integration into the assembly line local network through an at-line scheme. Thus high-precision data for assembly defects verification are included in the automated information loop, which brings production closer to the requirements of Industry 4.0 concept.