IEDM and ISSCC. The Best of Bests Development of 3D FinFETs and tunnel FETs with compound A3B5 semiconductor channel introduced at IEDM and ISSCC are considered.
Radiofrequency MEMS + CMOS. Matured Technology Ready for the Peak Hour Semiconductor technology advance led to the possibility to integrate MEMS and CMOS data processing ICs and create systems with enhanced functionality. What RF MEMS + CMOS technologies exist today?
Digital Computing Synthesizers. State of Art One of the main frequency synthesizers types are digital computing synthesizers. Their high frequency and phase resolution, fast frequency jumping without one-phase open fault, possibility of digital interface frequency, phase and some times amplitude control extends their applications in various electronic systems. The article represents technical solutions that are used in digital computing synthesizers design.
Domestic Coaxial Microstrip Adapters with Cutt-off Frequency 18 GHz. Materials, Design, Technology Capabilities of domestic coaxial microstrip adapters with cut-off frequency 18 GHz that are produced in lots more then 30 years haven’t come to the end. High performance materials, design advance and new technologic processes development today are important just as well as 10 years ago.
IBM. The Most Significant Strategic Realignment in the Past 20 Years Plans of IBM Corp. that constantly gets rid of unprofitable business, to sale its chip division are discussed.
Designing Antenna Arrays by means of HFSS and CST MWS Programs Popular electrodynamic modeling programs for business applications HFSS and CST MWS allow to solve major scientific problems when designing phased antenna arrays. The article compares the findings of antenna array characteristics achieved by programs HFSS and CST taking into account adjacent elements mutual influence.
MEMS inertial sensors and modules from European Manufacturers. Novelties Review The review deals with accelerometers, gyroscopes and inertial measurement modules for mobile objects and pilot-centered and navigation equipment stabilization and control.
Polymeric Tactile Sensors. Construction, Technology Polymeric Tactile Sensors. Construction, Technology
Sensors on the basis of tactile sensitive elements, T sensors with various dimensions, response, resolution are considered.
Gas and Fire Security. OJSC Avangard Sensors and Devices OJSC Avangard’s semiconductor gas sensors and devices on their basis developed in cooperation with NIIRM (Minsk) are identified.
Milandr’s Complex Solution for Accounting Energy Resources Consumption On the basis of power consumption measurement systems market analysis the main line of developments was determined. Requirements applicable to such devices are introduced. The most successful versions of computer-assisted power consumption revenue metering (CAPCRM) systems are considered.
EEPROMs in CMOS Technology Design Concepts Construction considerations of the cell of a erasable programmable read-only memory (EEPROM) produced in standard CMOS technology are distinguished. Several cell constructions and read/write behavior are analysed.
R&S RTM Oscillographs. Reversal Pulses Area Measurements Alternative pulses contain significant information about the processes that take place in the system. That’s why measurement of pulse signals parameters in particular their area is detached as a separate scientific research area. The alternative pulses area can be effectively measured by oscillographs methods How this an be done with the help of R&S RTM oscillographs tells this article.
Russian Supercomputer Technologies. Problems and Prospects The continuance of the Second national supercomputer forum review is dedicated to the problems of Russian supercomputer branch development, open source distributed computing and artificial cognitive systems advanced development.
Ethernet Solutions for Special Applications. Home Produced Hardware Components In resent years Ethernet technology has interpenetrated in our life. Ethernet popularity is due to its high data transfer rate, links organization simplicity, connections high reliability and interference suppression. But until later there were no domestic hardware components for it realization. This situation changed with the appearance of Iss Milandr ICs that enabled Ethernet interfaces for special apparatuses.
Metall-Composite Packages with a Cavity as an Alternative to Ceramic and Metall packages for ICs and Semiconductor Devices Current thermoreactive plastic (polymeric) packages almost are not used in systems that must work in severe operating conditions. In this article the analysis results of main characteristics of metal-ceramic, thermoreative packages and metal composite packages on the thermotropic liquid crystal polymer basis are summarized. It was found that quality of metal composite packages is equal to metal-ceramic packages, and their reducibility is equal to plastic packages.