rus
Competent opinion
V. Kovensky
OUR THOUGHTS AND ACTIONS ARE AIMED AT CREATING A MODERN PRODUCTION OF WORLD-CLASS MATERIALS DOI: 10.22184/1992-4178.2026.254.2.14.22
OUR THOUGHTS AND ACTIONS ARE AIMED AT CREATING A MODERN PRODUCTION OF WORLD-CLASS MATERIALS DOI: 10.22184/1992-4178.2026.254.2.14.22
R. Mangusheva
ECOSYSTEM APPROACH TO INDUSTRY COMMUNITY DEVELOPMENT IN 24/365 MODE DOI: 10.22184/1992-4178.2026.254.2.24.28
ECOSYSTEM APPROACH TO INDUSTRY COMMUNITY DEVELOPMENT IN 24/365 MODE DOI: 10.22184/1992-4178.2026.254.2.24.28
Column of radio-electronic industry department
Company Anniversary
Report from a company
Yu. Kovalevsky
ON THE VERGE OF A BREAKTHROUGH IN THE AUTOMATION OF WIRE HARNESS PRODUCTION. VISIT TO THE PRODUCTION FACILITY OF PROTECH LTD. DOI: 10.22184/1992-4178.2026.254.2.74.82
ON THE VERGE OF A BREAKTHROUGH IN THE AUTOMATION OF WIRE HARNESS PRODUCTION. VISIT TO THE PRODUCTION FACILITY OF PROTECH LTD. DOI: 10.22184/1992-4178.2026.254.2.74.82
Industry Events
Yu. Kovalevsky, E. Kasparova
NEW FACETS OF EFFICIENCY: TECHNOLOGIES OF THE FUTURE AND GROWTH STRATEGIES FOR RUSSIAN ELECTRONICS ENTERPRISES ALL-RUSSIAN INDUSTRY CONFERENCE “WORLD-CLASS MANUFACTURING – 2026”. PART 1 DOI: 10.22184/1992-4178.2026.254.2.68.72
NEW FACETS OF EFFICIENCY: TECHNOLOGIES OF THE FUTURE AND GROWTH STRATEGIES FOR RUSSIAN ELECTRONICS ENTERPRISES ALL-RUSSIAN INDUSTRY CONFERENCE “WORLD-CLASS MANUFACTURING – 2026”. PART 1 DOI: 10.22184/1992-4178.2026.254.2.68.72
Economy & Business
M. Makushin
3D ICs: MARKET GROWTH FORECASTS AND TECHNOLOGICAL CHALLENGES. PART 2 The second part of the article examines some of the technological and economic challenges of creating 3D ICs: design issues, advanced packaging methods, digital twins and reliability issues.
3D ICs: MARKET GROWTH FORECASTS AND TECHNOLOGICAL CHALLENGES. PART 2 The second part of the article examines some of the technological and economic challenges of creating 3D ICs: design issues, advanced packaging methods, digital twins and reliability issues.
Tags: 3d ic design mechanical stress packaging reliability корпусирование механические напряженности надежность проектирование 3d ис
DIGITAL AND MIXED-SIGNAL COMPONENTS
D. Sadekov
ARTERY TECHNOLOGY MICROCONTROLLERS: A NEW ERA OF PERFORMANCE DOI: 10.22184/1992-4178.2026.254.2.88.92
Artery Technology develops 32-bit microcontrollers based on ARM Cortex-M4/M0+ cores, which is highly competitive with leading global brands in performance and functionality. The article examines Artery Technology’s key microcontroller lines, comparing popular series with analogs from global manufacturers.
ARTERY TECHNOLOGY MICROCONTROLLERS: A NEW ERA OF PERFORMANCE DOI: 10.22184/1992-4178.2026.254.2.88.92
Artery Technology develops 32-bit microcontrollers based on ARM Cortex-M4/M0+ cores, which is highly competitive with leading global brands in performance and functionality. The article examines Artery Technology’s key microcontroller lines, comparing popular series with analogs from global manufacturers.
Manufacturing equipment and process materials
L. Karavdin
VIBROACOUSTIC MONITORING OF HYDRAULIC PRESSES FOR PREDICTIVE MAINTENANCE AND PROCESS CONTROL DOI: 10.22184/1992-4178.2026.254.2.124.127
The article examines the challenge of improving the operational reliability of forging and pressing equipment in the context of industrial digitalization. The high efficiency of vibroacoustic analysis is demonstrated not only for equipment condition diagnostics but also for automated process control.
VIBROACOUSTIC MONITORING OF HYDRAULIC PRESSES FOR PREDICTIVE MAINTENANCE AND PROCESS CONTROL DOI: 10.22184/1992-4178.2026.254.2.124.127
The article examines the challenge of improving the operational reliability of forging and pressing equipment in the context of industrial digitalization. The high efficiency of vibroacoustic analysis is demonstrated not only for equipment condition diagnostics but also for automated process control.
Tags: dynamic loading forging and pressing equipment vibration analyzer vibroacoustic monitoring анализатор вибрации виброакустический мониторинг динамическое нагружение кузнечно-прессовое оборудование
Engineering solutions
Sh. Shugaev, R. Akhmetgaliev, V. Egoshin, E. Ermolaev, V. Pozdeev
CURRENT TRENDS IN PRODUCTION OF PACKAGES FOR MICROELECTRONICS: ZPP JSC’S PRACTICES DOI: 10.22184/1992-4178.2026.254.2.114.116
ZPP JSC (part of the Element Group of Companies) is a dynamically developing enterprise in the Republic of Mari El. Its main focus is the design and production of new types of metal-ceramic packages for integrated circuits that meet modern microelectronics requirements.
CURRENT TRENDS IN PRODUCTION OF PACKAGES FOR MICROELECTRONICS: ZPP JSC’S PRACTICES DOI: 10.22184/1992-4178.2026.254.2.114.116
ZPP JSC (part of the Element Group of Companies) is a dynamically developing enterprise in the Republic of Mari El. Its main focus is the design and production of new types of metal-ceramic packages for integrated circuits that meet modern microelectronics requirements.
Tags: multi-pin package types – for power ics with integrated topology виды корпусов – для силовых интегральных схем многовыводные с интегрированной топологией
Test & Measurements
A. Bobryshov
MATHEMATICAL MODEL OF ACCURACY DYNAMICS FOR DIGITAL INSTRUMENTATION UNDER SHORT-TERM TEMPERATURE EXPOSURE DOI: 10.22184/1992-4178.2026.254.2.94.101
The study examines the effect of short-term temperature exposure on the operation of digital instrumentation. The temperature dependence of ammeter measurement errors is investigated experimentally. A mathematical model is developed that enables diagnostics of instrumentation under various external thermal conditions.
MATHEMATICAL MODEL OF ACCURACY DYNAMICS FOR DIGITAL INSTRUMENTATION UNDER SHORT-TERM TEMPERATURE EXPOSURE DOI: 10.22184/1992-4178.2026.254.2.94.101
The study examines the effect of short-term temperature exposure on the operation of digital instrumentation. The temperature dependence of ammeter measurement errors is investigated experimentally. A mathematical model is developed that enables diagnostics of instrumentation under various external thermal conditions.
Tags: instrumentation johnson – nyquist noise mathematical model temperature coefficient контрольно-измерительный прибор математическая модель температурный коэффициент шум джонсона – найквиста
A. Smirnov
PROBLEMS OF ENSURING ACCURATE MEASUREMENTS OF RADIOTECHNICAL VALUES BY THE EXAMPLE OF ELECTROMAGNETIC COMPATIBILITY TESTING. PART 2 DOI: 10.22184/1992-4178.2026.254.2.104.112
The second part of the article examines the metrological aspects of using measuring transducers in radio engineering measurements. It is shown that calibrating measuring transducers in accordance with regulated methods allows for an objective assessment of the measurement configuration and its impact on measurement error.
PROBLEMS OF ENSURING ACCURATE MEASUREMENTS OF RADIOTECHNICAL VALUES BY THE EXAMPLE OF ELECTROMAGNETIC COMPATIBILITY TESTING. PART 2 DOI: 10.22184/1992-4178.2026.254.2.104.112
The second part of the article examines the metrological aspects of using measuring transducers in radio engineering measurements. It is shown that calibrating measuring transducers in accordance with regulated methods allows for an objective assessment of the measurement configuration and its impact on measurement error.
Tags: calibration measurement error measuring transducers metrological support измерительные преобразователи калибровка метрологическое обеспечение погрешность измерений
Market Trends
M. Tsvetnikov, D. Frantsyshin
MARKET CAPACITY OF TRUSTED ELECTRONIC COMPONENT BASE FOR CRITICAL INFORMATION INFRASTRUCTURE OF THE RUSSIAN FEDERATION DOI: 10.22184/1992-4178.2026.254.2.128.134
The article identifies a list of critical information infrastructure (CII) entities and describes typical component sets for each equipment class. A quantitative assessment of the market capacity of trusted electronic component base (ECB) for the Russian Federation’s CII is provided. The study substantiates the economic feasibility of investments in expanding existing fabs and establishing new production facilities for 90 nm technology and below.
MARKET CAPACITY OF TRUSTED ELECTRONIC COMPONENT BASE FOR CRITICAL INFORMATION INFRASTRUCTURE OF THE RUSSIAN FEDERATION DOI: 10.22184/1992-4178.2026.254.2.128.134
The article identifies a list of critical information infrastructure (CII) entities and describes typical component sets for each equipment class. A quantitative assessment of the market capacity of trusted electronic component base (ECB) for the Russian Federation’s CII is provided. The study substantiates the economic feasibility of investments in expanding existing fabs and establishing new production facilities for 90 nm technology and below.
Tags: critical information infrastructure import substitution localization trusted electronic component base доверенная экб импортозамещение критическая информационная инфраструктура локализация
Reliability and tests
A. Trushina
ION CHROMATOGRAPHY IN MODERN MICROELECTRONICS DOI: 10.22184/1992-4178.2026.254.2.118.122
The article summarizes modern methods and applications of ion chromatography for the analysis of ultrapure water, chemical reagents, silicon wafer surfaces and cleanroom atmospheres.
The prospects for integrating this method into high-tech industrial environments are discussed.
ION CHROMATOGRAPHY IN MODERN MICROELECTRONICS DOI: 10.22184/1992-4178.2026.254.2.118.122
The article summarizes modern methods and applications of ion chromatography for the analysis of ultrapure water, chemical reagents, silicon wafer surfaces and cleanroom atmospheres.
The prospects for integrating this method into high-tech industrial environments are discussed.
Tags: chemical reagents eluent ion chromatography ion exchange column silicon wafers ultrapure water ионная хроматография ионообменная колонка кремниевые пластины ультрачистая вода химические реактивы элюент
for Engineers
Electromechanical components
D. Bakanin, M. Popov, E. Shadrunov
HYPERBOLOID CONTACTS: HIGH-RELIABILITY CONNECTOR SOLUTIONS DOI: 10.22184/1992-4178.2026.254.2.84.86
The article discusses the key advantages of hyperboloid contacts – a high-tech solution based on the principle of multipoint mating via a resilient wire basket. The paper provides an analysis
of the characteristics of the most sought-after hyperboloid contacts developed and manufactured by Radiant-EK JSC.
HYPERBOLOID CONTACTS: HIGH-RELIABILITY CONNECTOR SOLUTIONS DOI: 10.22184/1992-4178.2026.254.2.84.86
The article discusses the key advantages of hyperboloid contacts – a high-tech solution based on the principle of multipoint mating via a resilient wire basket. The paper provides an analysis
of the characteristics of the most sought-after hyperboloid contacts developed and manufactured by Radiant-EK JSC.