rus
Issue #2/2026
Sh. Shugaev, R. Akhmetgaliev, V. Egoshin, E. Ermolaev, V. Pozdeev
CURRENT TRENDS IN PRODUCTION OF PACKAGES FOR MICROELECTRONICS: ZPP JSC’S PRACTICES
CURRENT TRENDS IN PRODUCTION OF PACKAGES FOR MICROELECTRONICS: ZPP JSC’S PRACTICES
DOI: 10.22184/1992-4178.2026.254.2.114.116
ZPP JSC (part of the Element Group of Companies) is a dynamically developing enterprise in the Republic of Mari El. Its main focus is the design and production of new types of metal-ceramic packages for integrated circuits that meet modern microelectronics requirements.
Tags: multi-pin package types – for power ics with integrated topology виды корпусов – для силовых интегральных схем многовыводные с интегрированной топологией
Subscribe to the journal Electronics: STB to read the full article.
ZPP JSC (part of the Element Group of Companies) is a dynamically developing enterprise in the Republic of Mari El. Its main focus is the design and production of new types of metal-ceramic packages for integrated circuits that meet modern microelectronics requirements.
Tags: multi-pin package types – for power ics with integrated topology виды корпусов – для силовых интегральных схем многовыводные с интегрированной топологией
Subscribe to the journal Electronics: STB to read the full article.
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