rus
Competent opinion
Yu. Panferova
WE CREATE WORKPLACES: CURRENT THINKING ON PRODUCTION OF FURNITURE FOR THE ELECTRONICS INDUSTRY DOI: 10.22184/1992-4178.2026.253.1.12.18
WE CREATE WORKPLACES: CURRENT THINKING ON PRODUCTION OF FURNITURE FOR THE ELECTRONICS INDUSTRY DOI: 10.22184/1992-4178.2026.253.1.12.18
Column of radio-electronic industry department
Industry Events
Economy & Business
M. Makushin
3D IC: MARKET GROWTH FORECASTS AND TECHNOLOGICAL CHALLENGES. PART 1 DOI: 10.22184/1992-4178.2026.253.1.128.135
Estimates for 3D IC sales in 2024 range from $12 to $20 billion. 3D ICs are the result of the heterogeneous (in terms of functionality and design standards) integration of various elements. The article assesses the geographic structure of the global 3D IC market and provides sales forecasts through 2033.
3D IC: MARKET GROWTH FORECASTS AND TECHNOLOGICAL CHALLENGES. PART 1 DOI: 10.22184/1992-4178.2026.253.1.128.135
Estimates for 3D IC sales in 2024 range from $12 to $20 billion. 3D ICs are the result of the heterogeneous (in terms of functionality and design standards) integration of various elements. The article assesses the geographic structure of the global 3D IC market and provides sales forecasts through 2033.
Manufacturing equipment and process materials
A. Sobolev
MODERN CLUSTER EQUIPMENT OF ASIAN MANUFACTURE FOR CARRYING OUT TECHNOLOGICAL OPERATIONS UNDER THIN FILMS ON SEMICONDUCTOR WAFERS DOI: 10.22184/1992-4178.2026.253.1.48.56
The article provides an overview of various types of cluster equipment produced by Asian manufacturers for thin-film processing. Key cluster system parameters that influence thin-film etching, deposition and sputtering processes are discussed.
MODERN CLUSTER EQUIPMENT OF ASIAN MANUFACTURE FOR CARRYING OUT TECHNOLOGICAL OPERATIONS UNDER THIN FILMS ON SEMICONDUCTOR WAFERS DOI: 10.22184/1992-4178.2026.253.1.48.56
The article provides an overview of various types of cluster equipment produced by Asian manufacturers for thin-film processing. Key cluster system parameters that influence thin-film etching, deposition and sputtering processes are discussed.
Tags: magnetron sputtering plasma-chemical etching plasma-enhanced deposition plasma reactor special technological equipment thin films магнетронное распыление плазменно-стимулированное осаждение плазменный реактор плазмохимическое травление специальное технологическое оборудование тонкие пленки
I. Voznesensky
2,45 GHz MICROWAVE PLASMA: EFFECTIVE CLEANING OF GAPS IN FLIP-CHIP PACKAGES BEFORE UNDERFILLING DOI: 10.22184/1992-4178.2026.253.1.58.64
The article discusses a method for cleaning flip-chip packages using microwave plasma and describes specialized microwave plasma processing equipment. A comparative analysis of this method and conventional approaches is provided, highlighting its effectiveness in cleaning narrow gaps.
2,45 GHz MICROWAVE PLASMA: EFFECTIVE CLEANING OF GAPS IN FLIP-CHIP PACKAGES BEFORE UNDERFILLING DOI: 10.22184/1992-4178.2026.253.1.58.64
The article discusses a method for cleaning flip-chip packages using microwave plasma and describes specialized microwave plasma processing equipment. A comparative analysis of this method and conventional approaches is provided, highlighting its effectiveness in cleaning narrow gaps.
Tags: flip-chip technology fluxes microwave plasma microwave plasma cleaning technology underfill андерфил свч-плазма технология flip-chip технология микроволновой плазменной очистки флюсы
Engineering solutions
M. Solomatin
BERGQUIST SIL PAD THERMAL CONDUCTIVE MATERIALS: FEATURES AND BENEFITS The Bergquist brand’s product range includes several dozen materials, including thermally conductive pads, gels, thermal grease and adhesives. The article provides an overview of one of the most popular lines – SIL PAD thermally conductive insulators – as well as other Bergquist heat dissipation materials, their key features and applications.
BERGQUIST SIL PAD THERMAL CONDUCTIVE MATERIALS: FEATURES AND BENEFITS The Bergquist brand’s product range includes several dozen materials, including thermally conductive pads, gels, thermal grease and adhesives. The article provides an overview of one of the most popular lines – SIL PAD thermally conductive insulators – as well as other Bergquist heat dissipation materials, their key features and applications.
Tags: графитовый наполнитель полиимидная пленка полиэфирное волокно стекловолокно теплопроводящие материалы термопасты термопрокладки
G. Ivanov, A. Rozvadovsky, K. Stepanova
METHODS FOR REDUCING THE LEVEL OF ELECTROMAGNETIC RADIATION FROM INFORMATION DISPLAY DEVICES CONNECTED TO SATELLITE NAVIGATION EQUIPMENT DOI: 10.22184/1992-4178.2026.253.1.86.90
The article examines methods for reducing electromagnetic radiation levels generated by auxiliary equipment connected to satellite navigation systems, specifically media panels and LED displays.
The effectiveness of various filter designs and polyester shielding film is assessed.
METHODS FOR REDUCING THE LEVEL OF ELECTROMAGNETIC RADIATION FROM INFORMATION DISPLAY DEVICES CONNECTED TO SATELLITE NAVIGATION EQUIPMENT DOI: 10.22184/1992-4178.2026.253.1.86.90
The article examines methods for reducing electromagnetic radiation levels generated by auxiliary equipment connected to satellite navigation systems, specifically media panels and LED displays.
The effectiveness of various filter designs and polyester shielding film is assessed.
Tags: emi filter led display media panel satellite navigation equipment shielding polyester film аппаратура спутниковой навигации медиапанель светодиодное табло фильтр электромагнитных помех экранирующая полиэстерная пленка
CAD
A. Strogonov
FEATURES OF THE IMPLEMENTATION OF A PIPELINED RISC-V PROCESSOR CORE ON THE FPGA BASIS DOI: 10.22184/1992-4178.2026.253.1.122.127
The article discusses the design features of a 5-stage pipelined RISC-V processor core in Altera Quartus Prime Standard Edition CAD for subsequent implementation on the Cyclone V series FPGA basis.
FEATURES OF THE IMPLEMENTATION OF A PIPELINED RISC-V PROCESSOR CORE ON THE FPGA BASIS DOI: 10.22184/1992-4178.2026.253.1.122.127
The article discusses the design features of a 5-stage pipelined RISC-V processor core in Altera Quartus Prime Standard Edition CAD for subsequent implementation on the Cyclone V series FPGA basis.
Tags: code synthesis hardware description language modelsim altera pipeline processor risc-v architecture архитектура risc-v конвейерный процессор синтез кода язык описания аппаратуры
Test & Measurements
A. Smirnov
PROBLEMS OF ENSURING ACCURATE MEASUREMENTS OF RADIOTECHNICAL VALUES BY THE EXAMPLE OF ELECTROMAGNETIC COMPATIBILITY TESTING. PART 1 The article analyzes the compliance of the standardized metrological characteristics of radiotechnical measurement instruments
with the regulated requirements of measurement tasks for accuracy indicators using EMC testing as an example. An approach is proposed that enables the reliable determination
of the characteristics of measuring transducers.
PROBLEMS OF ENSURING ACCURATE MEASUREMENTS OF RADIOTECHNICAL VALUES BY THE EXAMPLE OF ELECTROMAGNETIC COMPATIBILITY TESTING. PART 1 The article analyzes the compliance of the standardized metrological characteristics of radiotechnical measurement instruments
with the regulated requirements of measurement tasks for accuracy indicators using EMC testing as an example. An approach is proposed that enables the reliable determination
of the characteristics of measuring transducers.
Tags: calibration electromagnetic compatibility testing measurements of radio engineering quantities metrological support измерения радиотехнических величин испытания на электромагнитную совместимость калибровка метрологическое обеспечение
N. Firsanov
PRESSURE SENSORS. SIMULATION OF OUTPUT SIGNAL DURING OPERATION The article proposes an improvement to current methods for determining verification intervals using pressure sensors as an example. This approach involves an in-depth study of the processes that lead to changes in metrological characteristics during operation.
PRESSURE SENSORS. SIMULATION OF OUTPUT SIGNAL DURING OPERATION The article proposes an improvement to current methods for determining verification intervals using pressure sensors as an example. This approach involves an in-depth study of the processes that lead to changes in metrological characteristics during operation.
Tags: physical model pressure sensor regression analysis verification interval датчик давления интервал между поверками регрессионный анализ физическая модель
R. Markovich
NEW AKIP DC POWER SUPPLIES DOI: 10.22184/1992-4178.2026.253.1.108.111
The article presents an overview of power supplies from PriST JSC, whose product range expanded significantly in 2025. New devices are systematized with a focus on the most interesting series.
NEW AKIP DC POWER SUPPLIES DOI: 10.22184/1992-4178.2026.253.1.108.111
The article presents an overview of power supplies from PriST JSC, whose product range expanded significantly in 2025. New devices are systematized with a focus on the most interesting series.
Tags: high-voltage multi-channel power supplies: two-quadrant programmable single-channel pulse высоковольтные источники питания: двухквадрантные многоканальные одноканальные импульсные программируемые
Microwave electronics
O. Basov, S. Yan
MATHEMATICAL MODEL OF TRANSFORMATION OF THE POLARIZATION VECTOR OF AN ELECTROMAGNETIC WAVE IN CASCADED STRIPLINE STRUCTURES DOI: 10.22184/1992-4178.2026.253.1.116.120
A mathematical model of transformation of the polarization vector of an electromagnetic wave in cascaded stripline structures has been developed. Its computational efficiency is 127 times higher than that of numerical methods used for calculating a 7-layer structure. The model is intended for the design of precision microwave polarization devices.
MATHEMATICAL MODEL OF TRANSFORMATION OF THE POLARIZATION VECTOR OF AN ELECTROMAGNETIC WAVE IN CASCADED STRIPLINE STRUCTURES DOI: 10.22184/1992-4178.2026.253.1.116.120
A mathematical model of transformation of the polarization vector of an electromagnetic wave in cascaded stripline structures has been developed. Its computational efficiency is 127 times higher than that of numerical methods used for calculating a 7-layer structure. The model is intended for the design of precision microwave polarization devices.
Tags: anisotropy cascaded stripline structures jones matrix mathematical model microwave polarization анизотропия каскадные полосковые структуры математическая модель матрица джонса поляризация свч
S. Yan
METHODOLOGY FOR DESIGNING TRANSDUCING DEVICES FOR MONITORING POLARIZATION CHARACTERISTICS FOR MICROWAVE GUIDING SYSTEMS DOI: 10.22184/1992-4178.2026.253.1.112.115
A mathematical model of transformation of the polarization vector of an electromagnetic wave in cascaded stripline structures has been developed. Its computational efficiency is 127 times higher than that of numerical methods used for calculating a 7-layer structure. The model is intended for the design of precision microwave polarization devices.
METHODOLOGY FOR DESIGNING TRANSDUCING DEVICES FOR MONITORING POLARIZATION CHARACTERISTICS FOR MICROWAVE GUIDING SYSTEMS DOI: 10.22184/1992-4178.2026.253.1.112.115
A mathematical model of transformation of the polarization vector of an electromagnetic wave in cascaded stripline structures has been developed. Its computational efficiency is 127 times higher than that of numerical methods used for calculating a 7-layer structure. The model is intended for the design of precision microwave polarization devices.
Tags: anisotropy cascaded stripline structures jones matrix mathematical model microwave polarization генетический алгоритм методика проектирования многокритериальная оптимизация неразрушающий контроль свч-направляющие системы
Production technologies
V. Lelyaev
METHODS OF GENTLE PROCESSING OF HARD AND SENSITIVE MATERIALS A key challenge in advancing microelectronic technologies is finding reliable and gentle methods for processing materials such as SiC and GaN. The article examines the main methods
for processing semiconductor materials, including scribing, disc cutting and laser beam cutting.
METHODS OF GENTLE PROCESSING OF HARD AND SENSITIVE MATERIALS A key challenge in advancing microelectronic technologies is finding reliable and gentle methods for processing materials such as SiC and GaN. The article examines the main methods
for processing semiconductor materials, including scribing, disc cutting and laser beam cutting.
Tags: disc cutting laser beam cutting scribing water jet guided laser cutting wide-bandgap semiconductors дисковая резка резка водонаправленным лазером резка лазерным лучом скрайбирование широкозонные полупроводники
Yu. Chernysheva, E. Ermolaev, V. Egoshin, Sh. Shugaepov, R. Akhmetgaliev
ZPP JSC’S SCIENTIFIC AND TECHNOLOGICAL APPROACH TO FILLING VIAS WITH METALLIZATION PASTE DOI: 10.22184/1992-4178.2026.253.1.72.73
The article examines ZPP JSC’s advanced approach to solving the problem of high-quality filling of small-diameter vias in IC metal-ceramic packages. This approach involves the use of metallization pastes with a high content of finely dispersed solid phase metal powder.
ZPP JSC’S SCIENTIFIC AND TECHNOLOGICAL APPROACH TO FILLING VIAS WITH METALLIZATION PASTE DOI: 10.22184/1992-4178.2026.253.1.72.73
The article examines ZPP JSC’s advanced approach to solving the problem of high-quality filling of small-diameter vias in IC metal-ceramic packages. This approach involves the use of metallization pastes with a high content of finely dispersed solid phase metal powder.
Tags: finely dispersed solid phase metal-ceramic packages metallization pastes vias мелкодисперсная твердая фаза металлизационные пасты металлокерамические корпуса переходные отверстия
S. Kruglov, O. Kryutchenko, A. Mannanov, V. Shevelev
TECHNOLOGICAL FEATURES OF REED SWITCH MANUFACTURING DOI: 10.22184/1992-4178.2026.253.1.74.78
The article presents the results of research aimed at improving the performance parameters of reed switches. Technological methods for manufacturing reed switches have been developed based on creating a microrelief on the surface of contact parts through controlled etching in acids.
TECHNOLOGICAL FEATURES OF REED SWITCH MANUFACTURING DOI: 10.22184/1992-4178.2026.253.1.74.78
The article presents the results of research aimed at improving the performance parameters of reed switches. Technological methods for manufacturing reed switches have been developed based on creating a microrelief on the surface of contact parts through controlled etching in acids.