OUR STATE HAS GOT STARTED DEVELOPING THINGS WHICH IT DID NOT TO UCH FOR DECADES DOI: 10.22184/1992-4178.2022.216.5.12.19
TRANSFORMATION OF US MICROELECTRONICS: FORMATION OF A CLOSED NATIONAL ECOSYSTEM OF MICROELECTRONICS ON THE EXAMPLE OF INTEL CORPORATION DOI: 10.22184/1992-4178.2022.216.5.122.128
The process of globalization was replaced by “nationalization”, that is the creation of closed ecosystems of microelectronics (mainly in the segments of semiconductor materials, equipment, CAD tools, IP blocks, etc.), independent of the rest of the world. These processes are clearly visible when analyzing the activities of Intel Corporation in the last year or two.
TECHNOLOGICAL EQUIPMENT MARKET, THE ISSUES OF EUV LITHOGRAPHY AND ADVANCED PACKAGING METHODS DOI: 10.22184/1992-4178.2022.216.5.30.40
The article analyzes the market of technological equipment for IC manufacture and promising trends for the development of semiconductor equipment. The driving factors for the development of the equipment market are the increasing use of EUV lithography and advanced packaging methods.
XORS‑200A IS A BASIC ETCHING MODULE FOR 65–32 nm MASS PRODUCTION DOI: 10.22184/1992-4178.2022.216.5.42.48
XORS‑200A narrow-gap planar module for dielectric etching developed by NPP ESTO JSC is a universal basic 200 mm etching reactor for mass silicon production featuring key 300 mm system level parameters and allowing both high-aspect dielectric etching and multipatterning processes.
POTENTIAL OF DOMESTIC DIAMOND. HEAT SINKS DOI: 10.22184/1992-4178.2022.216.5.50.61
The article discusses the current state and design features of heat sinks as one of the critical factors of electronics and photonics featuring extreme modes and operating conditions. It presents the results of the analysis of the global and Russian market of producers of synthetic diamonds for heat sinks and evaluates the diamond heat sinks innovativeness and development potential on basis of the publication and patent activity analysis.
TECHNOLOGICAL EQUIPMENT AND MATERIALS USED FOR METAL-CERAMIC PACKAGE MANUFACTURE DOI: 10.22184/1992-4178.2022.216.5.62.65
The article considers the technological equipment and materials used in Plant of Semiconductor Devices JSC (ZPP JSC) for the manufacture of metal-ceramic packages.
AUTOMATIC WEDGE MOUNTING MACHINE FOR SMALL DIAMETER WIRE INTERCONNECTS IN 2.5D ELECTRONIC MODULES DOI: 10.22184/1992-4178.2022.216.5.66.72
The article describes the problems that arise during wire interconnect high-speed mounting in multi-chip assemblies, in particular, in 2.5D structures with a large difference in height of bonding levels. The main characteristics of EM‑4520 ultrasonic bonding machine manufactured by “Planar-SO”, the Belarusian company, and its bonding system are given.
BERGQUIST BRAND THERMALLY CONDUCTIVE MATERIALS DOI: 10.22184/1992-4178.2022.216.5.74.77
Bergquist brand thermal management materials provide efficient heat transfer in a wide range of applications. The product range includes several dozen items, including heat-conducting pads, gels, adhesives. The article provides a brief overview of Bergquist materials, their key features and applications.
FEATURES OF THE USE OF CRYSTAL OSCILLATORS IN RADIO MEASURING EQUIPMENT DOI: 10.22184/1992-4178.2022.216.5.96.103
Crystal oscillators are the most widely used stable frequency source. The article discusses the main parameters of quartz oscillators and gives recommendations for achieving maximum frequency stability when using them in radio measuring equipment.
RUICHI SOLID STATE RELAYS: A RELIABLE ALTERNATIVE TO ELECTROMAGNETIC RELAYS DOI: 10.22184/1992-4178.2022.216.5.104.108
One of Ruichi’s most popular products is solid state relays, which are increasingly being used instead of traditional electromagnetic relays. The article discusses the principles of operation, characteristics and model range of solid state relays manufactured by Ruichi.
ARRANGEMENT OF THE WORKSTATION BASED ON THE REVERBERATION CHAMBER DOI: 10.22184/1992-4178.2022.216.5.84.86
TESTPRIBOR JSC expanded the technical capabilities of the EMC test laboratory and created a workstation based on a reverberation chamber. The new workstation provides testing of electronic equipment in accordance with the qualification requirements for resistance to high intensity electromagnetic fields.
DEEPENING SELF-MONITORING OF TEST AND VERIFICATION EQUIPMENT FOR CONTROL SYSTEMS: MONITORING AREAS EXPANSION DOI: 10.22184/1992-4178.2022.216.5.88.92
The article discusses the measures aimed at increasing the depth of test and verification equipment self-monitoring: the development of motherboard testing algorithms, drivers and storage media as part of the system unit, as well as deepening the expansion card testing algorithms not related to stimuli and reactions.
MICROWAVE OSCILLATORS BASED ON GUNN DIODES FROM LINWAVE TECHNOLOGY DOI: 10.22184/1992-4178.2022.216.5.112.113
The article considers the microwave oscillators based on Gunn diodes offered by Linwave Technology. Information about the features and characteristics of these generators is given.
“AKTU‑001” THERMAL SHOCK TESTING MACHINE DOI: 10.22184/1992-4178.2022.216.5.78.82
The article describes the automated chamber for semiconductor devices and ICs thermal shock testing development project being conducted by NIIET. It substantiates the project timeliness and provides technical data of the equipment under development and its advantages over foreign counterparts.
DEVELOPMENT OF AN IMPEDANCE SENSOR BASED ON SILICON-CARBON FILMS FOR THE DETECTION OF VOLATILE ORGANIC SUBSTANCES VAPORS DOI: 10.22184/1992-4178.2022.216.5.114.120
The article presents the results of a study of the gas sensitivity of sensors based on silicon-carbon films obtained by an easy-to-implement method of electrochemical deposition from organic electrolytes solutions.