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DOI: 10.22184/1992-4178.2022.216.5.78.82
The article describes the automated chamber for semiconductor devices and ICs thermal shock testing development project being conducted by NIIET. It substantiates the project timeliness and provides technical data of the equipment under development and its advantages over foreign counterparts.
The article describes the automated chamber for semiconductor devices and ICs thermal shock testing development project being conducted by NIIET. It substantiates the project timeliness and provides technical data of the equipment under development and its advantages over foreign counterparts.
Теги: electronic components tests hot and cold chamber reliability testing equipment thermal shock испытания электронных компонентов испытательное оборудование камеры тепла и холода надежность тепловой удар
“AKTU‑001” THERMAL SHOCK TESTING MACHINE
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