ESD SAFETY IS PRIMARILY A MATTER OF RELIABILITY DOI: 10.22184/1992-4178.2025.251.9.12.18
MODERNIZATION OF SCORING SYSTEMS AS A TOOL FOR ACHIEVING TECHNOLOGICAL LEADERSHIP DOI: 10.22184/1992-4178.2025.251.9.50.54
The rules for recognizing industrial products as Russian require improvement, as the current version of the scoring system methodology lacks incentives for the development of Russian innovations. The article proposes measures to modernize the scoring system, taking into account the impact of domestic developments on the implementation of import substitution goals and achieving technological independence.
ELECTROMAGNETIC COMPATIBILITY: STANDARDS, EQUIPMENT, AND PRACTICAL RESULTS “EMC” ALL-RUSSIA SCIENCE AND TECHNOLOGY FORUM DOI: 10.22184/1992-4178.2025.251.9.42.46
SPECIFICS OF THE COMPLEX TECHNICAL SYSTEM SYNTHESIS DOI: 10.22184/1992-4178.2025.251.9.134.138
Modern complex technical systems (including information, communication and control systems) are subject to stringent requirements, primarily regarding their ability to perform their tasks. The article proposes an approach to synthesizing complex systems that ensures their stable operation.
Keywords: complex technical systems, communication system, control system, monitoring, system synthesis, operation
Ni/Al2O3 POWDERS FOR NEW METAL-DIELECTRIC VARISTOR STRUCTURES DOI: 10.22184/1992-4178.2025.251.9.56.60
The article examines the technology for producing metal-dielectric varistor structures based on metallic Ni powders coated with a thin layer of Al2O3 dielectric. The dielectric coating
was formed using atomic layer deposition.
SINGLE-CHANNEL AND DUAL-CHANNEL DIP PACKAGES FOR THE ASSEMBLY AND SEALING OF INTEGRATED CIRCUIT DIE DOI: 10.22184/1992-4178.2025.251.9.76.78
The article presents the design and manufacturing technology of two standard metal-ceramic packages (MK 2101.8-8.01 and MK 2101.8-8.02) for the assembly and sealing of integrated circuit dies. These packages provide stable protection of the dies from external factors.
HIGHLY VISCOUS THIXOTROPIC THERMALLY CONDUCTIVE ELECTRICAL INSULATING MATERIAL NOMACON™ KPTD-4 DOI: 10.22184/1992-4178.2025.251.9.82.86
The article examines the characteristics of NOMAKON™ KPTD-4,
a high-viscosity, thixotropic, thermally conductive electrical insulating material, including thermal conductivity, penetration
and dielectric strength. It also describes the material’s application
for the electronic equipment components mounting.
DEVELOPMENT OF A HALL EFFECT SENSOR BASED ON A SOI MOSFET WITH VOLTAGE CONTROL The article presents a SOI MOSFET Hall effect sensor developed at ZNTC JSC. An experimental integrated circuit for non-contact magnetic field sensing with a linear analog output was designed and tested. The obtained characteristics of the device demonstrate its applicability in various technical fields requiring precise measurements and control.
CIRCUIT SIMULATION OF TITANIUM DIOXIDE MEMRISTORS IN LTspice DOI: 10.22184/1992-4178.2025.251.9.88.97
Much attention is being paid to research into memristors and the development of neuromorphic systems based on them in our country; however, there are virtually no examples
of the implementation of Spice models of memristors in the domestic literature. The article examines the implementation of three well-known memristor models in LTspice: Batas, Joglekar and Biolek.
RF CONNECTORS AND CABLE ASSEMBLIES AT THE 27TH EUROPEAN MICROWAVE WEEK. PART 1 DOI: 10.22184/1992-4178.2025.251.9.114.121
The article examines the cutting-edge achievements of several international companies in the field of microwave connectors, cables and cable assemblies. The first part of the article considers polymer RF connectors from Corning and cable assemblies from SV Microwave and Smiths Interconnect.
Keywords: cables, cable assemblies, connectors
INELSO: BLITZSensor, BLITZMotor AND BLITZConnect COMPONENTS FOR UNMANNED VEHICLES DOI: 10.22184/1992-4178.2025.251.9.122.125
INELSO provides a comprehensive supply of key components for use in unmanned, autonomous vehicles. The article provides an overview of the target markets for unmanned vehicles
and a selection of specialized electronic and electromechanical components offered by INELSO under the BLITZSensor, BLITZMotor and BLITZConnect brands.
AUTOMATION OF FAN COOLING TOWER OPERATION TAKING INTO ACCOUNT VIBRATION LEVEL DOI: 10.22184/1992-4178.2025.251.9.126.132
The article examines the problem of increased vibration in fan cooling towers at Gazpromneft Moscow Refinery JSC. Findings indicate that blade eccentricity, caused by installation errors, leads to vibration levels exceeding GOST standards. An automated control algorithm has been developed to control fan operation, ensuring safe exploitation and preventing accidents.
AGILE METHODOLOGY IN THE EDUCATION OF STUDENTS AT THE ADVANCED ENGINEERING SCHOOL OF TULA STATE UNIVERSITY: FROM THEORY TO PRACTICE DOI: 10.22184/1992-4178.2025.251.9.140.143
The article presents an innovative methodology for training engineers, implemented at the Tula Engineering School «Intelligent Defense Systems.» A key element of the educational program is the Agile approach that integrates theory, practice,
and the development of professional competencies.
Keywords: Agile methodology, engineering education, AES TulSU, interdisciplinary teams, practice-oriented learning, Scrum, sprints, T-shaped competencies
SLIDING CONTACT TECHNOLOGIES PROGRESS IN RUSSIA, ILLUSTRATED BY IC ENGINEERING LLC DEVELOPMENTS DOI: 10.22184/1992-4178.2025.251.9.70.74
IC Engineering LLC develops and manufactures advanced electromechanical systems based on sliding contact devices.
The article presents rotating contact devices (RCD) by IC Engineering, which transmit electrical power, control signals and data between stationary and rotating components. Their characteristics and applications are described.
APPLICATION OF THE DAVIDON – FLETCHER – POWELL METHOD FOR FINDING THE PARAMETERS OF A SPECIFIED CONCENTRATION PROFILE DURING ION IMPLANTATION The article is devoted to the application of the Davidon – Fletcher – Powell method for finding the minimum of the objective function in the calculation of concentration profile parameters during ion implantation. The developed program has demonstrated high efficiency in determining the optimal parameters, confirming the adequacy of the approach for solving the stated problem.
OXIDE LAYER ETCH-BACK OPTIMIZATION DURING TSV FORMATION DOI: 10.22184/1992-4178.2025.251.9.98.102
The article presents an overview of methods for optimizing the oxide layer etching process during the Through-Silicon-Via (TSV) formation. It further analyzes their impact on the quality
and reliability of 3D integrated circuits.
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