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Calculation of thermal resistance between the junction of microwave monolithic IC mounted on PCB and external environment The article considers simple method for calculating the thermal resistance between the junction of microwave monolithic IC mounted on printed circuit board (PCB) and external environment. It is noted that this method allows us to estimate accurately the thermal resistance of PCB, the thermal resistance between the junction and external environment as well as junction temperature.
Verilog projects implementation in the basis of custom LSI and FPGA using Yosys synthesis tool Yosys (Yosys Open SYnthesis Suite) synthesis tool is widely used in designing custom LSI and FPGAs in university centers. This open source software suit processes almost any Verilog-2005 project translating it to BLIF, EDIF, BTOR, SMT-LIB, etc. The article considers the features of Yosys usage when implementating Verilog projects in the basis of custom LSI and FPGA.
Design tools for engineering systems of the future. Making the impossible possible and the common easy The article discusses the challenges posed to software tools used in electronics design process by the current technology conditions and development tends in electronics area. It reviews the features and advantages of certain software solutions by NI.
Hdl projects development peculiarities for implementation in the basis of 5578TS FPGA series 5578TS FPGA series from KTC ELECTRONICA JSC is in intermediate position between low-end Altera Cyclone II series and high-performance Altera Stratix III FPGA series according to implemented architectural solutions. The article considers the features of the FPGA logical resources usage when implementating the different projects using benchmarks from Altera QUIP toolkit 9.0.
ODU system solutions: trust professionals ODU hold steady position in the market of high-quality connectors. The article considers system solutions of the German manufacturer that is assemblies with various types of connectors.
Microelectronic sensors with extended functionality based on thin-film SoI mdsdm transistor with integrated channel The article considers the advantages and prospects of using thin-film field-effect transistors with integrated channel made by silicon-on-insulator (SoI) technology as sensitive elements of Hall sensors and other types of sensors.
Digital signal processing: new solution The article describes new digital signal processor (DSP) 1967VN058 designed in PKK Milandr JSC. It is noted that it stake on improvement of data processing efficiency by increasing the operational frequency, more number of computing cores and using a set of various peripheral devices.
Radio-electronic systems with active phased arrays: directions of development and applications Recently accelerated development of active phased arrays (APAR) is caused by their fast adoption in weapons control radio-electronic systems. APAR not only improves the effectiveness of weapons systems but also largely determines the export potential of countries participating in international arms trade.
Instantaneous frequency measurement: methods and devices The article considers the methods of instantaneous frequency measurement (IFM) and devices in which they are implemented. It is noted that the fast and ubiquitous expansion of new radio electronic technologies and facilities creates the basis for the wide use of IFM receivers.
Development of business models of electronics: foreign experience and actuality for Russia. Part 2 The article focuses on the development of silicon factories, the peculiarities of ecosystems formation at the stage of reintegration and the influence of the mergers/acquisitions process on the interaction between manufacturers of IP and final electronic systems. The author analyzes the possibilities of applying foreign experience in Russian conditions.
Power GaN amplifiers in QFN packages: continuous operation The article considers the problem of ensuring the continuous mode operation of GaN amplifiers in QFN packages. By the example of Qorvo TGA2307-SM amplifier it is shown that continuous operation is possible when the chip is mounted on a PCB with copper pads under condition of reliable contact between an amplifier package, PCB and heatsink.
New TDK-Lambda DC-DC convertors: failure-proof element for reliable systems The article discusses the characteristics of TDK-Lambda HQA DC-DC convertors product line, provides their suggested connection diagram, describes the solutions ensuring reliable operation of these modules.
Internet of things strengthens its positions on the russian market The article reviews results of researches performed by IDC, PwC and others in respect of IoT major application areas and development in Russia. It discusses the specific features of Russian IoT market including the factors impeding making decisions in favor of this concept.