RUSSIAN MARKET OF ELECTRONIC EQUIPMENT BECOMES THE MARKET OF DOMESTIC MANUFACTURERS DOI: 10.22184/1992-4178.2021.202.1.10.16
“ELECTRONICA” AWARD: FOCUSING ON PRODUCT VALUE TO CUSTOMER DOI: 10.22184/1992-4178.2021.202.1.18.20
THE FIRST YEAR OF IMPLEMENTATION OF THE RUSSIAN FEDERATION ELECTRONICS INDUSTRY DEVELOPMENT STRATEGY FOR THE PERIOD UP TO 2030 THE KEY POINTS OF THE INTERVIEW WITH V. V. SHPAK, DIRECTOR OF THE RADIO-ELECTRONIC INDUSTRY DEPARTMENT
TREND TOWARDS COMPREHENSIVE ELECTRONIC MANUFACTURING SERVICES VISIT TO ASSEMBLY FACILITY OF REZONIT DOI: 10.22184/1992-4178.2021.202.1.36.46
NATIONAL AND MUNICIPAL PROCUREMENT LEGISLATION ENFORCEMENT PRACTICE MEETING OF THE DEFENSE INDUSTRIAL COMPLEX SECTION OF THE EXPERT COUNCIL OF THE FEDERATION COUNCIL COMMITTEE ON DEFENSE AND SECURITY
The foundry industry is increasingly becoming the manufacturing base of semiconductor industry. Market players cover the full range of technological needs of IC vendors. The prospect for the industry is strong enough but could be influenced by US high-tech policies in the near future.
HOW TO ACCELERATE TRANSITION TO INDUSTRY 4.0 WITH INDUSTRIAL ETHERNET DOI: 10.22184/1992-4178.2021.202.1.110.115
The Industry 4.0 concept is based on the maximum use of information to make optimal production decisions. Timely data access and transmission throughout the enterprise infrastructure depend on the communication network. The article discusses the features and benefits of Industrial Ethernet as a promising tool for creating an effective communication environment at smart enterprise.
LOCAL RADIATION SHIELDING OF SPACECRAFT ELECTRONIC COMPONENTS DOI: 10.22184/1992-4178.2021.202.1.166.172
To reduce the radiation dose of spacecraft electronic components from streams of electrons and radiation belt protons local radiation shields are used which are produced on the basis of high atomic number and high density materials (tungsten, tantalum, W-Cu composite, etc.).
EMS TECHNOLOGICAL TRENDS AND MARKET CONDITIONS IN RUSSIA DOI: 10.22184/1992-4178.2021.202.1.48.52
The article assesses the present conditions and dynamics of the Russian EMS market based on experience of Macro EMS ltd. It discusses current technological trends as well as Russian EMS companies’ opportunities to enter foreign markets.
NPO StarLine: COMPETITIVE CONTRACT MANUFACTURING DOI: 10.22184/1992-4178.2021.202.1.54.59
The article describes the technological equipment for large-scale electronic component assembly site and shopfloor control system implemented on it, which allows executing complex orders on a turnkey basis and producing large batches of products in a limited time providing the company with a leading position at the contract assembly market.
PRODUCTION PROCESS FLEXIBILITY AND CONSTRUCTIVE CUSTOMER RELATIONSHIPS ARE THE CONDITIONS FOR SUCCESS OF A CONTRACT MANUFACTURER DOI: 10.22184/1992-4178.2021.202.1.60.62
The article considers the issues of the technological process organization, the use of equipment and building relationships with the customer from the point of view of the senior process engineer of the multiproduct assembly contract manufacturing of electronics.
IMPROVEMENT OF THE SCIENTIFIC-METHODOLOGICAL APPARATUS FOR THE PROCESSES OF REDUCING THE IMPORT DEPENDENCE OF RADIO ELECTRONIC EQUIPMENT ON FOREIGN ELECTRONIC COMPONENTS DOI: 10.22184/1992-4178.2021.202.1.162.165
The article considers the issues of improving the scientific-methodological apparatus for the analysis and preparation of proposals for reducing the dependence of domestic electronic equipment on foreign electronic components.
MEASURING VSWR OF SIGNAL GENERATORS DOI: 10.22184/1992-4178.2021.202.1.86.89
The article discusses various methods of measuring VSWR of signal generators and evaluates their applicability in instrument calibration. It is concluded that in terms of validity and ease of use the hot S-parameters and the mismatched wattmeter methods are optimal.
FRONT-END OF READOUT ELECTRONICS FOR SILICON DETECTORS: PREAMPLIFIER AND SHAPER DOI: 10.22184/1992-4178.2021.202.1.138.158
Depending on the technical requirements the units for processing signals from silicon detectors used to register ionizing radiation in experiments in the field of high-energy physics and cosmic rays physics are implemented in analog, analog-digital and digital format. The article discusses the features and circuit solutions for the front-end of readout electronics for silicon detectors, more specifically preamplifier and shaper.
VAUNIX DIGITAL MATRIX ATTENUATORS DOI: 10.22184/1992-4178.2021.202.1.90.91
The article considers Vaunix digital matrix attenuators and provides information on the features, characteristics and applications of these devices.
SPECIAL CONSIDERATIONS WHEN DESIGNING THE ELECTROMECHANICAL MICROWAVE SWITCH DOI: 10.22184/1992-4178.2021.202.1.92.96
The article describes the design and some features of the contact system of the microwave switch developed and mass-produced at Irkutsk Relay Plant JSC. The developed product by its characteristics is not inferior to foreign microwave switches.
The article considers high-speed solid state microwave switches. Information on integrated and waveguide pin-diode switches produced by a number of manufacturers is given.
INTEGRATED INFORMATION SECURITY TECHNOLOGIES IN SCYTHIAN SOC FOR MOBILE AND EMBEDDED SYSTEMS DOI: 10.22184/1992-4178.2021.202.1.116.129
NPC ELVIS JSC has developed Scythian 11 core heterogeneous system on chip, designed for building mobile and embedded intelligent systems that require complex data processing under limited power consumption and keeping trusted authority. The article discusses the key features of the integrated information security technology implemented both in a separate Scythian SoC and as part of a single domestic technological platform offered by NPC ELVIS.
HIGH-FREQUENCY 5G WIRELESS INFRASTRUCTURE REQUIRES A NEW APPROACH TO PCB MANUFACTURING DOI: 10.22184/1992-4178.2021.202.1.82.84
The new generation of AOI, which is entering the market today, implements inspection technologies that allow automatic operations that were previously performed manually, as well as integrate in one system multiple functions which were performed by several individual tools up to now.
PLASMA-CHEMICAL MICROETCHING. THE ALTERNATIVE TO PERMANGANATE CLEANING OR THE RESCUE FOR FLUOROPLASTICS DOI: 10.22184/1992-4178.2021.202.1.78.80
The article deals with the process of plasma-chemical microetching, which is used in the manufacture of multilayer PCBs and atypical dielectric double-sided PCBs. The process is carried out at Tepla microetching unit.
OPTIMIZATION OF PARALLEL COMPUTING FOR ONBOARD REAL-TIME SYSTEMS. Part 2 DOI: 10.22184/1992-4178.2021.202.1.130.136
It is shown that efficient planning of a parallel computational process in onboard computing systems can be ensured using the methods of network planning and control in conjunction with the mathematical apparatus of parallel multilevel graphs and mathematical programming.