OUR TASK IS TO UNITE SPECIALISTS REPRESENTING THE ENTIRE CHAIN OF DESIGN AND PRODUCTION OF MEDICAL EQUIPMENT DOI: 10.22184/1992-4178.2021.211.10.12.18
HOW TO TRAIN PERSONNEL FOR MODERN PRODUCTION DOI: 10.22184/1992-4178.2021.211.10.20.24
PRODUCTION OF PRINTED CIRCUIT BOARDS USING DOMESTIC MATERIALS WILL GIVE IMPETUS TO THE DEVELOPMENT OF RUSSIAN TECHNOLOGIES DOI: 10.22184/1992-4178.2021.211.10.26.30
HOW TO ACHIEVE PROMPTNESS IN LINE WITH THE SPIRIT OF THE TIMES VISIT TO ASSEMBLY FACILITY OF PO ELEKTROPRIBOR JSC DOI: 10.22184/1992-4178.2021.211.10.52.62
MICROWAVE MODULE ASSEMBLY: SMD ASSEMBLY AND MICROELECTRONIC TECHNOLOGY AT ONE SITE VISIT TO ASSEMBLY FACILITY OF MICROWAVE SYSTEMS JSC DOI: 10.22184/1992-4178.2021.211.10.64.72
DIGITAL TRANSFORMATION: OPEN WINDOW OF OPPORTUNITY DOI: 10.22184/1992-4178.2021.211.10.32.33
ENHANCEMENT OF LEGISLATION FOR THE DEVELOPMENT AND PRODUCTION OF ADVANCED PIECES OF ARMAMENTS AND MILITARY AND SPECIAL PURPOSE EQUIPMENT MEETING OF THE FEDERATION COUNCIL COMMITTEE ON DEFENSE AND SECURITY DOI: 10.22184/1992-4178.2021.211.10.48.51
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS. Part 2 DOI: 10.22184/1992-4178.2021.211.10.128.133
The article considers the issues of end-to-end integration of design tools for modern IC and microassembly packages using digital twin technology: integrated product component design taking into account thermal characteristics, thermomechanical stresses and signal integrity.
PROSPECTS FOR THE DEVELOPMENT OF MONOLITHIC MICROWAVE ICs AND GaN RADIO DEVICES DOI: 10.22184/1992-4178.2021.211.10.74.83
The article discusses the prospects for the development of the market and technologies for monolithic microwave ICs and radio devices based on GaN and GaAs. It is noted that the development prospects largely depend on the technology used for microwave ICs and radio devices.
VERIFICATION OF STANDARD MICROWAVE TECHNOLOGIES IN RUSSIAN: HOW TO MAKE SRPP AND JEDEC FRIENDS? DOI: 10.22184/1992-4178.2021.211.10.84.93
The article presents a comparative analysis of the methodology and regulatory framework in the field of development and production start-up of microwave electronic components abroad and in Russia. There are proposed the solutions that allow combining the development algorithms recommended by JEDEC with the domestic regulatory framework.
WHY AN INTEGRATED TRANSLATION LOOP DEVICE PROVIDES THE LOWEST PHASE NOISE DOI: 10.22184/1992-4178.2021.211.10.94.99
This article reviews several methods for low phase noise signal generation. Introduced Analog Devices' translation loop device that combines the best performance of all frequency generation methods to produce ultra-low phase noise signals.
RF AMPLIFIERS FROM ANALOG DEVICES: NEW PRODUCTS OVERVIEW DOI: 10.22184/1992-4178.2021.211.10.102.105
Analog Devices offers all the components you need to build an RF/microwave signal chain and create devices operating at frequencies up to 100 GHz. The article provides an overview of new products in the line of RF amplifiers released by the company recently.
HIGH-FREQUENCY AND MICROWAVE WIREWOUND CHIP INDUCTORS OF CC AND FC TYPES: PARAMETERS AND APPLICATIONS DOI: 10.22184/1992-4178.2021.211.10.106.111
ERKON NN Ltd is a well-known Russian designer and manufacturer of passive electronic components. The article describes the key parameters of company’s wirewound RF and microwave chip inductors, their applications, examples of CAD modeling using the models of chip inductors.
MICROWAVE COMPONENTS FROM CHENGDU AINFO Inc. DOI: 10.22184/1992-4178.2021.211.10.112.120
Chengdu AINFO Inc. (A-INFO), China is a well-known developer and manufacturer of microwave and millimeter wave components. The article presents the brief overview of its products and the description of some of the new antennas types.
THE USE OF CERAMICS FROM ZPP JSC IN METAL-AND-CERAMIC PACKAGES OPERATING IN THE MICROWAVE RANGE DOI: 10.22184/1992-4178.2021.211.10.122.126
The article presents the results of the investigation of dielectric properties of ceramic substrates produced by Plant of Semiconductor Devices JSC. It is noted the possibility of using the ceramics to create all-new promising metal-and-ceramic packages, designed for operation in the microwave range up to 40 GHz.
XILINX VERSAL FPGA ARCHITECTURE AND APPLICATIONS DOI: 10.22184/1992-4178.2021.211.10.136.140
The article reviews Xilinx Versal FPGA. Their feature is the addition of a matrix of VLIW architecture processors. It provides information about the architecture, characteristics and applications of Xilinx Versal FPGA.
NEW LEASE OF LIFE OF WAVE SOLDERING TECHNOLOGY. Part 2 DOI: 10.22184/1992-4178.2021.211.10.142.151
The article discusses a number of aspects of mass wave soldering process organization using modern solutions to achieve a high level of product quality and production flexibility, including considerations such as selection of conveyor type, use of nitrogen, production process control and monitoring, etc. It provides a basic calculation method of productivity of THT-components assembly and soldering line based on this technology.
OPTIMIZATION OF GALVANIC PROCESSES IN MODERN SEMICONDUCTOR MANUFACTURING. Part 2 DOI: 10.22184/1992-4178.2021.211.10.152.157
The article reviews the galvanic processes used in modern semiconductor manufacturing. Information is provided on various ways to optimize such processes.