WE CONSIDER OUR MISSION AS OVERCOMING THE LACK OF TRUST IN CONTRACT MANUFACTURING DOI: 10.22184/1992-4178.2022.213.2.12.18
JSCNIIMA PROGRESS: COMPLETED PROJECTS AND DEVELOPMENT STRATEGY DOI: 10.22184/1992-4178.2022.213.2.20.22
TO PRODUCE COMPLICATED STATE-OF-THE-ART COMPUTING EQUIPMENT ONE NEED TO HAVE THE BEST PRODUCTION SOLUTIONS VISIT TO PRODUCTION FACILITY OF “RIKOR ELECTRONICS” PJSC DOI: 10.22184/1992-4178.2022.213.2.36.47
PRODUCTION OF RUSSIAN PHOTONIC INTEGRATED CIRCUITS REACHES INDUSTRIAL LEVEL VISIT TO THE INTEGRATED PHOTONICS LABORATORY AND CHIP FABRICATION FACILITY AT JSC “ZNTC” DOI: 10.22184/1992-4178.2022.213.2.48.55
IC CONTRACT MANUFACTURING: THE WORLD’S LEADING SILICON FABS ARE EXPANDING THEIR CAPACITIES. PART 2 DOI: 10.22184/1992-4178.2022.213.2.70.78
The article discusses the achievements of SMIC under US sanctions, the success of Samsung Foundry and its significance for the implementation of the Korean Semiconductor Belt program, as well as the use of the silicon fab business model by Intel Corporation as part of the corporate IDM 2.0 strategy.
LOCALIZATION OF INTEGRATED CIRCUITS PACKAGING IN RUSSIA: THE MARKET IS READY DOI: 10.22184/1992-4178.2022.213.2.80.81
The article discusses market prerequisites and prospects for localization of IC production in Russia, in particular, the technological capabilities of Russian enterprises in IC packaging.
OVERVIEW OF NEW PRODUCTS FROM MAXIM INTEGRATED DOI: 10.22184/1992-4178.2022.213.2.138.141
Maxim Integrated’s product portfolio includes more than 6000 products, including analog, digital and mixed-signal components. The article provides a brief overview of the new Maxim Integrated products announced last year.
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS. PART 4 DOI: 10.22184/1992-4178.2022.213.2.82.86
The article considers the main stages and program modules of the best-in-class solutions for verification and testing of complex heterogeneous chip packages for efficient and error-free transfer of the project to production.
METHODS FOR SUPPRESSING ELECTROMAGNETIC INTERFERENCE OF A DC / DC SWITCHING CONVERTER DOI: 10.22184/1992-4178.2022.213.2.154.157
Using the CA-IS3092W transceiver chip from Shanghai Chipanalog Microelectronics as an example, the article discusses ways to suppress radiated electromagnetic interference from the built-in DC / DC switching converter.
A NEW EFFICIENT WAY TO OPTIMIZE A SIGNAL CHAIN WITH A CONTINUOUS-TIME SIGMA-DELTA ADC DOI: 10.22184/1992-4178.2022.213.2.158.159
The article discusses the use of continuous-time sigma-delta (CTSD) ADC as a new way to optimize the circuit design, reduce the number of electronic components used and the form factor.
MODERN INDUCTIVE RADIO COMPONENTS. PART 1 DOI: 10.22184/1992-4178.2022.213.2.142.152
The article considers the modern inductive radio components. Information is provided on the main types, characteristics and manufacturers of such components.
US MICROELECTRONICS: INITIATIVES AND APPROACHES TO IMPROVE THE NATIONAL SYSTEM OF PERSONNEL TRAINING DOI: 10.22184/1992-4178.2022.213.2.56.69
The article discusses the US government policy aimed at returning the production of advanced chips to its territory, which exacerbated the internal staff shortage in the country and required the implementation of new initiatives and approaches at all management levels from corporate to state ones.
SOME CONSIDERATIONS ON CIVIL ELECTRONICS DEVELOPMENT USING THE EXAMPLE OF ACTIVITY OF NIIET DOI: 10.22184/1992-4178.2022.213.2.128.136
The article discusses some practical considerations on entering civil electronics market, niches and windows of opportunities which can be used by Russian companies, using the example of NIIET’s activity in development of civil area.
ADVANCED E-Mobility DEVELOPMENTS The article considers the advanced developments in the field of E-Mobility aimed at developing infrastructure and equipment for charging electric vehicles. Notably, Keysight’s Scienlab charger test solutions enable vehicle manufacturers and charging station suppliers to test charging interfaces of EV and charging devices during high power charging.
MEMS PACKAGING: PROBLEMS AND SOLUTIONS DOI: 10.22184/1992-4178.2022.213.2.88.92
Packaging of microelectromechanical systems (MEMS) is one of the most difficult stages of their production that still remains a bottleneck in the mass production of products. This paper focuses on the problem of high vacuum MEMS sealing technology and ways of its solving.
ZPP JSC’S BUMPS FOR MATRIX PACKAGES IS ANOTHER STEP TOWARDS TECHNOLOGICAL INDEPENDENCE DOI: 10.22184/1992-4178.2022.213.2.94.96
The article considers the characteristics and features of the technology for mounting bump contacts from Plant of Semiconductor Devices JSC (ZPP JSC). It is noted that this seemingly insignificant element of the chip is able to provide new horizons for the development of radioelectronic equipment.
SINTERING TECHNOLOGY IN THE DOMESTIC PRACTICE OF POWER AND PULSE ELECTRONICS BASED ON SILICON CARBIDE DOI: 10.22184/1992-4178.2022.213.2.98.105
An engineering center of microtechnology and diagnostics has been created at LETI St. Petersburg Electrotechnical University on use various options for modern silver sintering technology in domestic practice.
PROSPECTS AND POSSIBILITIES FOR THE PRODUCTION OF microLED DISPLAYS DOI: 10.22184/1992-4178.2022.213.2.106.113
The article reviews a number of technological developments for the production of microLED displays. Full commercialization of microLED displays is expected to become a reality in the coming years.
STANDARDIZATION OF TECHNOLOGIES FOR MANUFACTURING MATRICES FOR COOLED THERMAL IMAGERS: IS IT “WARM” OR “COLD”? DOI: 10.22184/1992-4178.2022.213.2.114.119
The principle of technological processes standardization widely used in creating the microwave electronic components, significantly increases the efficiency of development and production of domestic cooled matrix IR photodetectors based on A3B5 nanoheterostructures.