ISSCC 2105. New MPUs and MCUs. More Complex and Attractive. Part 2 Intel’s, AMD’s and IBM’s high performance processors and up-to-date energy efficient digital ICs are considered.
Electronics Equipment Electromagnetic Compatibility Problems. Summarizing TESTPRIBOR’s conference results Results of the scientific and technical conference that was held in Moscow at May 20 and was dedicated to protection of electronic equipment against EM radiation and to hardware testing for electromagnetic compatibility.
Extended Session of Electronics Industry Enterprises Directors Report about the most interesting presentations announced at the session.
How to support Domestic Chips and Radio Facilities Designers and Manufacturers in the Open Market? Future developments and production of home-made mass-produced navigating-communication apparatus, including chips and module are analyzed. It’s demonstrated that in spite of general lag behind global leaders there exist domestic devices quite nationally competitive
Semiconductor Substrates Microdefects Automatic Control KBTEM-OMO (Minsk) annonced a processing unit EM-6429 for automatic control microdefects of wafers with microscale topological layout that permits to solve many problems occurring in case of manufacturing ultrafine scale ICs.
Thin Structures Visualisation. Up-to-Date Technologies. Part 2 Scanning electronic microscopes operation and causes of contrast formation under electrons influence are reviewed.
3-Millimeter Range Magnetrons Power Combiner For increasing pulse power and stabilization of microwave electronic equipment frequency various magnetrons power adding methods are used. Experimental results of two magnetrons power adding and synchronization with the help of a superdimensional waveguide bridge are given.
Up-to-date piezoelectric devices: New Capabilities Some modern home-developed high functional piezoelectric devices such as generators and magnetic field sensors are considered.
Choosing a MCU: 8 bit or 32 bit? A closer look at recent MCU market trends reveals that not only the 32-bit devices are experiencing strong growth. 8-bit MCUs are also showing a compound growth rate close to that of 32-bit: 6,4% compared to 32-bit 6,9%. This article aims to give some insight to the reasons why 8-bit devices are retaining market share.
High Performance SRAMs – Development Challenges High capacity and performance static random-access memories development problems are analyzed.
Ceramic-and-metal substrates and LSICs packages. Providing vacuum tightness Authors propose a method for calculating the volume of glue paste that is required for securing vacuum tight ceramic-and-metal packages constructions.
DRF: DIN Mounting Premium Power Sources Peculiar properties and capabilities of the series DRF devices, implemented in TDK-Lambda’s high efficiency, multifunction and high reliability power sources market program, are considered.