rus
Competent opinion
N. Boldyrev
We Are Now In The Transition Phase To The Transport Of The Future DOI: 10.22184/1992-4178.2025.250.8.12.18
We Are Now In The Transition Phase To The Transport Of The Future DOI: 10.22184/1992-4178.2025.250.8.12.18
Column of radio-electronic industry department
Engineering solutions
S. Vorobyov
Open cavity plastic packages – advantages, problems and solutions DOI: 10.22184/1992-4178.2025.250.8.120.126
The article examines the design features of open cavity plastic packages (OCPP) and the materials used in their manufacture, particularly liquid crystal polymers. The advantages of OCPP,
such as improved high-frequency performance and increased thermal resistance, are analyzed.
Keywords: epoxy molding compound, open
cavity plastic packages, liquid crystal polymer,
thermoplastic
Open cavity plastic packages – advantages, problems and solutions DOI: 10.22184/1992-4178.2025.250.8.120.126
The article examines the design features of open cavity plastic packages (OCPP) and the materials used in their manufacture, particularly liquid crystal polymers. The advantages of OCPP,
such as improved high-frequency performance and increased thermal resistance, are analyzed.
Keywords: epoxy molding compound, open
cavity plastic packages, liquid crystal polymer,
thermoplastic
Production Management
S. Dashkov, S. Filippova
Contract Manufacturing: From a Weak Link to a Strong Chain. Part 2 DOI: 10.22184/1992-4178.2025.250.8.132.134
The article considers projects implemented by A-CONTRACT engineers over the company’s more than 20 years of operation in the Russian contract manufacturing market, as well as innovative solutions to non-standard tasks arising in the production of high-tech electronic components and modules.
Keywords: contract manufacturing, design documentation,
project optimization
Contract Manufacturing: From a Weak Link to a Strong Chain. Part 2 DOI: 10.22184/1992-4178.2025.250.8.132.134
The article considers projects implemented by A-CONTRACT engineers over the company’s more than 20 years of operation in the Russian contract manufacturing market, as well as innovative solutions to non-standard tasks arising in the production of high-tech electronic components and modules.
Keywords: contract manufacturing, design documentation,
project optimization
Test & Measurements
M. Makushin
Some Aspects of the Development of IC Testing and Verification Methodologies DOI: 10.22184/1992-4178.2025.250.8.30.40
With the adoption of ever smaller design rules, the increasing
use of 3D designs and heterogenous (with diverse design rules
and functionality) multi-chip/multi-chiplet modules, the need
for new verification methods arises.
Keywords: artificial intelligence, machine learning,
automation, testing methods
Some Aspects of the Development of IC Testing and Verification Methodologies DOI: 10.22184/1992-4178.2025.250.8.30.40
With the adoption of ever smaller design rules, the increasing
use of 3D designs and heterogenous (with diverse design rules
and functionality) multi-chip/multi-chiplet modules, the need
for new verification methods arises.
Keywords: artificial intelligence, machine learning,
automation, testing methods
A. Gatalsky, Yu. Kovalevsky
Anniversary Of Signal Hound: From A Low-Budget Spectrum Analyzer To Large-Scale Industry Solutions DOI: 10.22184/1992-4178.2025.250.8.42.48
The article provides information on the history and development of Signal Hound product line, the company’s new solutions, and the advantages of its equipment for Russian users. It also compares a number of characteristics of Signal Hound spectrum analyzers and signal generators with those of other vendors’ instruments.
Keywords: microwave test and measurement equipment, spectrum analyzer, signal generator, vector network analyzer, phase noise analyzer, microwave switch, RF measurements,
RF monitoring
Anniversary Of Signal Hound: From A Low-Budget Spectrum Analyzer To Large-Scale Industry Solutions DOI: 10.22184/1992-4178.2025.250.8.42.48
The article provides information on the history and development of Signal Hound product line, the company’s new solutions, and the advantages of its equipment for Russian users. It also compares a number of characteristics of Signal Hound spectrum analyzers and signal generators with those of other vendors’ instruments.
Keywords: microwave test and measurement equipment, spectrum analyzer, signal generator, vector network analyzer, phase noise analyzer, microwave switch, RF measurements,
RF monitoring
R. Markovich
Using the Pulse Measurement Option in the AKIP-4214 Series Spectrum Analyzers DOI: 10.22184/1992-4178.2025.250.8.50.54
The Pulse Analysis feature in the AKIP-4214 spectrum analyzer provides powerful tools for analyzing pulsed signals, allowing engineers to effectively evaluate the dynamic behavior of signals in modern systems.
Keywords: AKIP-4214, RF pulses, spectrum analyzer, spectrum measurement methods
Using the Pulse Measurement Option in the AKIP-4214 Series Spectrum Analyzers DOI: 10.22184/1992-4178.2025.250.8.50.54
The Pulse Analysis feature in the AKIP-4214 spectrum analyzer provides powerful tools for analyzing pulsed signals, allowing engineers to effectively evaluate the dynamic behavior of signals in modern systems.
Keywords: AKIP-4214, RF pulses, spectrum analyzer, spectrum measurement methods
K. Epifantsev
New physical principles and methods for measuring shape defects DOI: 10.22184/1992-4178.2025.250.8.56.60
The article presents an overview of methods for measuring shape and continuity defects, analyzes their advantages and disadvantages. It describes measurement systems that do not require hard-to-find components and can be assembled from available element base.
Keywords: multisensority, roundness tester, domestic devices, import substitution, software products
New physical principles and methods for measuring shape defects DOI: 10.22184/1992-4178.2025.250.8.56.60
The article presents an overview of methods for measuring shape and continuity defects, analyzes their advantages and disadvantages. It describes measurement systems that do not require hard-to-find components and can be assembled from available element base.
Keywords: multisensority, roundness tester, domestic devices, import substitution, software products
K. Volkov
A device for dynamic monitoring of the main functional characteristics DOI: 10.22184/1992-4178.2025.250.8.62.66
A device has been developed that allows for dynamic determination of the main functional characteristics of the self-propagating high-temperature synthesis occurring in multilayer thin-film structures. The article presents a block diagram and describes the device’s design.
Keywords: self-propagating high-temperature synthesis, functional characteristics, multilayer thin-film structures, dynamic monitoring
A device for dynamic monitoring of the main functional characteristics DOI: 10.22184/1992-4178.2025.250.8.62.66
A device has been developed that allows for dynamic determination of the main functional characteristics of the self-propagating high-temperature synthesis occurring in multilayer thin-film structures. The article presents a block diagram and describes the device’s design.
Keywords: self-propagating high-temperature synthesis, functional characteristics, multilayer thin-film structures, dynamic monitoring
Yu. Anisimov
Measurement and test fixtures. Software and hardware complexes from design to quality control DOI: 10.22184/1992-4178.2025.250.8.68.74
IC Socket LLC develops and manufactures measurement and test fixtures, including sockets of any complexity. The article describes various types of such fixtures, including functional
test boards, electro-thermal burn-in boards, carrier boards and interface boards.
Keywords: measurement and test fixtures, sockets, test stations, software
Measurement and test fixtures. Software and hardware complexes from design to quality control DOI: 10.22184/1992-4178.2025.250.8.68.74
IC Socket LLC develops and manufactures measurement and test fixtures, including sockets of any complexity. The article describes various types of such fixtures, including functional
test boards, electro-thermal burn-in boards, carrier boards and interface boards.
Keywords: measurement and test fixtures, sockets, test stations, software
Microwave electronics
K. Dzhurinsky
Radio Frequency Connectors and Cables as Sources of Passive Intermodulation in Wireless Communication Systems Part 2 DOI: 10.22184/1992-4178.2025.250.8.114.118
Based on a large number of foreign and domestic publications, the article examines the physical processes that cause passive intermodulation in radio frequency connectors and cables used in wireless communication systems. Methods for reducing passive intermodulation are presented.
Keywords: passive intermodulation, signal-to-noise ratio, contact corrosion, skin effect
Radio Frequency Connectors and Cables as Sources of Passive Intermodulation in Wireless Communication Systems Part 2 DOI: 10.22184/1992-4178.2025.250.8.114.118
Based on a large number of foreign and domestic publications, the article examines the physical processes that cause passive intermodulation in radio frequency connectors and cables used in wireless communication systems. Methods for reducing passive intermodulation are presented.
Keywords: passive intermodulation, signal-to-noise ratio, contact corrosion, skin effect
Reliability and tests
O. Bordyuzha, M. Gorlov
Comparative evaluation of the reliability of transistor and diode batches DOI: 10.22184/1992-4178.2025.250.8.82.90
The article proposes six methods for comparatively assessing the quality and reliability of semiconductor device batches. Variable parameters and characteristics are described, and the methods’ reliability is analyzed. All methods are patented and tested on batches of semiconductor products manufactured at Russian electronics industry enterprises.
Keywords: comparative evaluation, quality and reliability, batch of semiconductor devices, transistor current transfer ratio
Comparative evaluation of the reliability of transistor and diode batches DOI: 10.22184/1992-4178.2025.250.8.82.90
The article proposes six methods for comparatively assessing the quality and reliability of semiconductor device batches. Variable parameters and characteristics are described, and the methods’ reliability is analyzed. All methods are patented and tested on batches of semiconductor products manufactured at Russian electronics industry enterprises.
Keywords: comparative evaluation, quality and reliability, batch of semiconductor devices, transistor current transfer ratio
R. Glazunov
Solutions for measuring and calibrating electronic component parameters in a temperature range from T°Lab DOI: 10.22184/1992-4178.2025.250.8.76.80
The article summarizes T°Lab’s experience in creating measurement and calibration rigs for electronic components across a wide temperature range. The proposed solutions simplify operations, improve reliability, and significantly reduce the cost of test equipment.
Keywords: сlimatic chambers, temperature range, test board, motherboard/backplane, vibration isolation
Solutions for measuring and calibrating electronic component parameters in a temperature range from T°Lab DOI: 10.22184/1992-4178.2025.250.8.76.80
The article summarizes T°Lab’s experience in creating measurement and calibration rigs for electronic components across a wide temperature range. The proposed solutions simplify operations, improve reliability, and significantly reduce the cost of test equipment.
Keywords: сlimatic chambers, temperature range, test board, motherboard/backplane, vibration isolation
O. Chuprinova
Model for estimating the number of possible faults in printed circuit assemblies DOI: 10.22184/1992-4178.2025.250.8.92.96
The article discusses a model for assessing the number of faults in printed circuit assemblies, based on the analysis of factors influencing the occurrence of defects, such as technological errors, materials, operating conditions and assembly methods.
Keywords: assessment of the number of faults
in printed circuit assemblies, intelligent test and diagnostics
of printed circuit boards
Model for estimating the number of possible faults in printed circuit assemblies DOI: 10.22184/1992-4178.2025.250.8.92.96
The article discusses a model for assessing the number of faults in printed circuit assemblies, based on the analysis of factors influencing the occurrence of defects, such as technological errors, materials, operating conditions and assembly methods.
Keywords: assessment of the number of faults
in printed circuit assemblies, intelligent test and diagnostics
of printed circuit boards
S. Antonychev, A. Antsev, E. Ezhov, E. Minakov, E. Yanov
Vibration diagnostics and predictive analytics in fuel and energy equipment lifecycle management DOI: 10.22184/1992-4178.2025.250.8.100.104
The article demonstrates typical sensor installation errors and the consequences of incorrect diagnostics, which led to resonance phenomena and the risk of fan failure in a three-section cooling tower. It concludes that a transition from a reactive to a proactive maintenance strategy is necessary.
Keywords: cooling tower, vibration sensor,
IIoT, FMEA
Vibration diagnostics and predictive analytics in fuel and energy equipment lifecycle management DOI: 10.22184/1992-4178.2025.250.8.100.104
The article demonstrates typical sensor installation errors and the consequences of incorrect diagnostics, which led to resonance phenomena and the risk of fan failure in a three-section cooling tower. It concludes that a transition from a reactive to a proactive maintenance strategy is necessary.
Keywords: cooling tower, vibration sensor,
IIoT, FMEA
Electromechanical components
M. Popov, D. Bakanin
Miniature Connector Contacts: Design and Electrical Parameters DOI: 10.22184/1992-4178.2025.250.8.106.112
The article examines the design features and electrical parameters of miniature connector contacts with a pitch smaller than 1.3 mm.
It demonstrates that a promising design is the twist pin contact with seven contact points, providing low contact resistance and high wear resistance.
Keywords: miniature connectors, contact pitch,
twist pin, flex pin, stamped pin
Miniature Connector Contacts: Design and Electrical Parameters DOI: 10.22184/1992-4178.2025.250.8.106.112
The article examines the design features and electrical parameters of miniature connector contacts with a pitch smaller than 1.3 mm.
It demonstrates that a promising design is the twist pin contact with seven contact points, providing low contact resistance and high wear resistance.
Keywords: miniature connectors, contact pitch,
twist pin, flex pin, stamped pin
Production technologies
R. Akhmetgaliev, N. Krasheninnikova, E. Alibekova, V. Egoshin, E. Ermolaev, Sh. Shugaepov, S. Alibekov
Characteristics of Electroplating Processes for IC Metal-Ceramic Packages DOI: 10.22184/1992-4178.2025.250.8.128.131
The article analyzes the main challenges of applying nickel-gold electroplating to the bases of metal-ceramic packages, the most common causes of poor coating adhesion to the substrate,
and possible solutions.
Keywords: metal-ceramic packages, nickel-gold electroplating, nickel plating, adhesion
Characteristics of Electroplating Processes for IC Metal-Ceramic Packages DOI: 10.22184/1992-4178.2025.250.8.128.131
The article analyzes the main challenges of applying nickel-gold electroplating to the bases of metal-ceramic packages, the most common causes of poor coating adhesion to the substrate,
and possible solutions.
Keywords: metal-ceramic packages, nickel-gold electroplating, nickel plating, adhesion