rus
Issue #8/2025
R. Akhmetgaliev, N. Krasheninnikova, E. Alibekova, V. Egoshin, E. Ermolaev, Sh. Shugaepov, S. Alibekov
Characteristics of Electroplating Processes for IC Metal-Ceramic Packages
Characteristics of Electroplating Processes for IC Metal-Ceramic Packages
DOI: 10.22184/1992-4178.2025.250.8.128.131
The article analyzes the main challenges of applying nickel-gold electroplating to the bases of metal-ceramic packages, the most common causes of poor coating adhesion to the substrate,
and possible solutions.
Tags: adhesion metal-ceramic packages nickel-gold electroplating nickel plating адгезия гальванического покрытия «никель-золото» металлокерамические корпуса никелирование
Subscribe to the journal Electronics: STB to read the full article.
The article analyzes the main challenges of applying nickel-gold electroplating to the bases of metal-ceramic packages, the most common causes of poor coating adhesion to the substrate,
and possible solutions.
Tags: adhesion metal-ceramic packages nickel-gold electroplating nickel plating адгезия гальванического покрытия «никель-золото» металлокерамические корпуса никелирование
Subscribe to the journal Electronics: STB to read the full article.
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