Consolidated information and analytical center as an essential tool for the development of defence industry complex
Economic aspects of the development of microelectronics in China The article analyzes the current state of microelectronics of China. It is noted that the further development of chinese microelectronics is associated with deeper integration into the national economy and the use of new approaches and technologies including artificial intelligence. The country’s government has set the task of increasing domestic IC production in order to reduce dependence on imported products.
The need for interlaboratory comparisons in modern metrology In the practice of metrological support of electronic production a technology to achieve and maintain the required accuracy of industrial measurements such as interlaboratory comparison tests (ICT) is becoming increasingly important. The article discusses the implementation of the requirements of existing standards in the part related to ICT and provides a brief information about the Dipol’s ICT pilot project on results of verification and calibration of electrical measuring instruments.
Software and hardware near-field transformations for 5G over-the-air testing The article considers software and hardware near-field transformations that can be used for over-the-air measurement of 5G communication system characteristics. The advantages of various transformation methods are noted.
Are there any oscilloscopes for electromagnetic field? The article considers the use of LSProbe 1.2 field sensor from LUMILOOP GmbH for measuring the pulsed electromagnetic field strength. It is noted that LSProbe 1.2 is a kind of «oscilloscope» for the electromagnetic field. It measures the amplitude of high-intensity fields and records their values in time domain, which are displayed by virtue of the companion software.
Experimental verification of methods for measuring parameters of coaxial-waveguide components with a shaped cross-section The article presents the results of experimental verification of methods for measuring parameters of coaxial-waveguide components with a shaped cross-section. It considers the approaches to estimating the measurement results uncertainty.
Miniaturization of equipment through the use of specialized microassemblies based on domestic ICs The article considers Flip-Chip and RDL (redistribution layer) technologies which PKK Milandr has successfully applied in its own designs. These approaches enable to reduce significantly the size of end equipment. The use of Flip-Chip and RDL technologies most often does not require redesigning of chips and therefore microassemblies use proved and verified ICs.
Channel structure for readout electronics of silicon detectors Multichanneling is one of the features of readout electronics (RE) of instrumentation for experiments in the field of high-energy physics and other classes of devices based on silicon systems for ionizing radiation detection. The article discusses the main structural solutions for RE and the factors influencing the choice of the structural scheme for multichannel detection system.
Broadband microwave bridged attenuator The article presents the original structure of microwave attenuator manufactured using CMOS SOI technology. The feature of this structure is the possibility of continuous adjustment of attenuation by means of use of field-effect transistors as variable impedances. The effective attenuation frequency range of the attenuator is 1–12 GHz with an attenuation coefficient of at least 32 dB. In a narrower frequency band the attenuation coefficient exceeds 50 dB.
Sun tracking device in photovoltaic power stations The article rates the advantages of incorporating a sun tracking system into the solar power station (SPS). It considers the control modes for cloudy and sunny weather, basic data for the tracking system algorithm, the configuration of rotation mechanism, the controller circuit and its links to SPS units and program section to solve one of the tasks of SPS unit control.
TDK-Lambda GXE series power supplies: controlled power in industrial form factor TDK-Lambda introduced the new series of power supplies with a wide range of functions and control modes. The article discusses the design features, operating modes, communication capabilities and application fields of new devices.
Ensuring security when connecting industrial embedded systems to cloud services The introduction of Industry 4.0 infrastructure and remote manufacturing and control concept is associated with the risk of unwanted access to very expensive assets. The article discusses the ways to ensure protection against potential threats to Internet of Things networks using Microchip’s integrated solution.
CMOS photodetector arrays: current state and development prospects CMOS photodetectors are the most dynamically developing sector of semiconductor industry. The main application areas of devices are automotive industry, artificial intelligence and video surveillance systems, smart phones, etc. 3D photodetector technology advancements greatly influenced the development of assembly technology for all types of electronic modules.