To Have Two Chips is Good, but One is Better. Programmable Digital Chips with Analog Interface Designers that develop various electronic analog processing systems often have to use both analog (amplifiers, comparators, ADC and so on) and digital (processors, peripherals and FPGAs) chips. This leads to complexity of device’s dimensions, manufacturing and cost increase. Cypress, Actel (Microsemi) and Xilinx offer versatile solutions with the help of which it is possible to realize a single chip analog-digital information processor and simplify its development and debugging
High Frequency Contact Measurement Fixtures for Monitoring SAW Filters frequency Characteristicss In spite of plenty various measurement tools Hi-tech electronics industry sector needs cheep, high and low temperature-resistant, simple technical solutions that provide multiple nondestructive connections. Modern measurement instrumentation producers hitg quality units usually are very expensive and single-proposed. That is why alternative solutions that allow connection of four-terminal devices to existing measurement instrumentation is still high. Generally companies and organizations that have to measure components electric characteristics have exclusive proper know-how but there are few new publications about specific technical solutions of this problem. That’s why HF experience and basic construction and production principles of contact measurement instrumentation for SAW filters frequency characteristics reading with 70 dB discrimination in the temperature range fron -60 to 85˚С are so attractive.
Analog-Digital Converter AD760х: Multifunctional Performance and Advanced Peripherals In many instances for emerges a need to simultaneous measure and/or monitor a number of electronic circuits’ physical values. The first measurement step involves digital conversion of these values. Analog Devices offers an effective instrument for performing this analog-digital conversion – AD760х.
ADCs with Output Digital Stream Synchronization. New NXP Solution In September 2010 NXP announced ADC1443D, the first high speed ADC at the market with a digital interface on the SerDes basis that satisfies JESD204B requirements. Among this device integrated performance capabilities there is a so called MDS (Multiple Device Synchronization) function. Due to this function NXP extended advantages of its CGVxpress interface JEDEC JESD204B realization.
Maxim’s Modern Low Energy Consuming DACs and ADCs as Perfect Solutions for Various Miniature Systems Maxim Integrated Products Inc. was founded in 1983 in Sunnyvale, California. Today it is an acknowledged leader at the DACs and ADCs semiconductor components world market. The company produces 29 main product types and performs 160 technologic processes (the company is producing 180-nm devices on 300mm wafers). Company’s product line includes microcontrollers, DACs, ADCs, dozen chips for fiber-optic, wire and wireless communication systems, variety special automobile audio and video chips etc. More then 500 special custom chips were developed together with customers.
X Parameters as an Effective Instrument for Electronic Circuits Analysis Today engineers that are developing active components (amplifiers, frequency doublers and others) electronic circuits more often face the need to simulate their behavior during high power microwave signals. In this case active components usually function in nonlinear mode and conventional methods for describing them on the linear model basis turn out to be useless. Agilent Technologies created an effective instrument X parameters aimed at nonlinear circuits development and analysis.
SiGe Technology for High Speed LeCroy Oscillographs Today silicon-germanium (SiGe) components are used extensively in ADCs and processors. They have excellent reliability, low energy consumption, LSI level. LeCroy – one of the instrumentation equipment industry leaders – already uses SiGe components in its oscillographs for several months. They allowed to meaningful improve their characteristics.
Photolithography. Solution the Problem of Precision Alignment of Silicon Layers After Epitaxy It’s impossible to create up-to-date IC (IC that demand 40, 60 and 120V power supply) without novel semiconductor technologies. Usually for enhancement of components characteristics these IC are bipolar chips with thick (more then 13 m) epitaxial layers with buried layers. Their design rules are 2 m and in the future they will decrease. There is projection printing photolithographic equipment with automatic alignment and exposure, for instance EM-584AM (design rules down to 1.5 m) or EM5084B (design rules down to 0.8 m), from KBTM-OMO or similar equipment from other producers. As a rule all Russian microelectronic enterprises have equipment of that sort. growth use will declane. Alongside with that the LEDs lighting market grows thanks for governmental measures of many countries that address SSL- development.
Parylene Films Etching in Low-Pressure Systems with High Density Plasma Polyparaxylylene (PPX) represents a linear polymer, which films are widely used as waterproof coatings of various electronics and microelectronics products (printed circuits boards. ICs, microwave devices and others). Recently interest in PPX as an interlayer biocompatible low-k dielectric for medicine, MEMS and other applications is growing.
International Electronic Devices Meeting IEDM. The Most Speedy, the Most Small, the Most Novel Chips International Electron Devices Meeting (IEDM) is one of the distinguished international events where producers and scientific organizations represent outstanding technologic achievements in semiconductor and electronic devices physics, design, production and simulation. Due to evolution of nanometrics CMOS technology, new advanced memories, displays, sensors, MEMS, novelty quantum and nanosystems, energy harvesting devices at the conference that was held 2011 Dec.5–7 had three tracks. The first theme was how manufacturable FinFETs will be over the next two or tree years. The second track was the competition between a never-say-die phase charge (PCRAM), spin torque transfer MMRAM (STT-MRAM), IBM’s fascinating racetrack memory and resistive RAMs (RRAMs). The third track was on further-out technologies including grapheme, tunnel FETs (properly on III-V materials) and nanowires.
IPC PCB with Bottom Termination Components Design and Assembly Standards Application of bottom termination components (BTC) grows due to a less package thickness, less land pattern, less stray parameters and higher thermal characteristics. At the same time application of these components cause some questions, for one terminations dimensions and vias pitch and diameter choice, as well as methods of vias protection against solder wicking, stencil design for optimal past coverage, solder profile. On the IPC standards basis these problems and other important BTC application points are considered.
IC ADAS1000 as an optimal solution for ECG Systems In the process of designing medicine equipment particulary ECG systems its important to maintain some security and functionality stringent requirements. Such characteristics as autonomy and performance are also important. These requirements can be satisfied by using standard components in the hardware design. Analog Devices has designed a special purpose interface chip ADAS1000 for ECG systems.