The task of the service is to ensure the customer’s satisfaction with the equipment throughout its life cycle. Visit to the service center of Rohde & Schwarz
Solid-state microwave switches Part 2 The article reviews the modular microwave switches of various types. The information on the parameters and features of the switches produced by a number of manufacturers have been observed.
Configuring the emc test laboratory with an open architecture The article considers the principles of construction and features of EMC compliance open architecture test laboratory by the example of EMC laboratory project for Innovation Design Center of Technopark-Mordovia.
Plasma asymmetrical dipole antenna: the measurement of signal characteristics The article considers the measurement of the spectrum of frequency-modulated signals emitted by a plasma asymmetrical dipole antenna (PADA) as well as a similar metal asymmetrical dipole antenna (MADA). It is noted that the modulated signal emitted by PADA is not inferior in quality as a whole to the signal from MADA and even exceeds it by some parameters.
Quality control of coatings using X-ray fluorescence analysis The article examines the quality control of coatings by means of X-ray fluorescence analysis using energy dispersive spectrometers (EDS). It is noted that EDSs enable to perform automated control of quality (thickness) of single-layer as well as multilayer coatings with the thickness from a few tens of microns to tens of nanometers across the sample surface. It is important for increasing the efficiency of present-day production facilities.
1879vya1ya VLSI. Pseudo-noise signal processing The article considers the pseudo-noise signal processing in 1879VYa1Ya VLSI. Various methods of processing are analyzed. The estimation of the productivity of these methods and recommendations for their use are given.
Simulation and advanced circuit analysis in PSpice 2017 Part 2 The article considers the features of new version of PSpice analog/analog-digital circuit simulator from Cadence with PSpice Advanced Analysis option.
Directions and options for the development of domestic electronics industry. Panel discussions of microelectronics 2017 forum
Mergers/acquisitions wave in microelectronics: causes and consequences The article considers the features of latest mergers / acquisitions cycle of microelectronic companies (2015–2017): fast and wavy growth of production volumes; reduction in the number of largest suppliers in the key market segments; multiple transactions.
From box solutions to system integration or what could be made from a simple sewing machine SWR group has augmented SolidWorks Enterprise PDM system in accordance with Russian standards. The article considers the additional software and solutions developed for this system.
Feature-rich and flexible next-generation I/O controllers for industrial and embedded computing designs The article considers the latest generation of Microchip’s SCH322X Super I/O controllers family featuring an extended set of functions, small size packages and long life cycle.
To the 75th anniversary of NRC Kurchatov institute: supercomputer technologies for digital economy and Industry 4.0 Based on the information presented at Russian Supercomputing Days 2017 conference the article describes the examples of the use of supercomputing in the development of products as well as its prospects in the context of digital economy creation. It underlines a number of relevant objectives on the formation of conditions for the development of digital economy and implementation of Industry 4.0 concept.
Reliable ODU contacts are an answer to everything! The reliability of electronic device directly depends on the quality of connectors, primarily on the contacts used in them. The article considers all of the types of ODU electrical contacts including novelties. Some variants of their application are given.
Quasi-deterministic model of thermal effects when producing the holes in printed circuit boards The results of experimental studies described in the article allow at the technological preparation stage to simulate the process of component holes and vias production in printed circuit boards taking into account the random nature of drill heating in the process of cutting.