The Crucial Task for Adoption of Domestic Technologies Is Coordination between Producer and User DOI: 10.22184/1992-4178.2020.193.2.10.16
Demand for Electronic Product Cleaning Is Dictated by Growing Reliability Requirements Visit to Zestron analytic departments' labs DOI: 10.22184/1992-4178.2020.193.2.60.66
productronica and SEMICON Europa 2019: automation and speed. Part 2 DOI: 10.22184/1992-4178.2020.193.2.32.58
The article considers the options for embedding components into printed circuit boards. The recommendations are given on the organization of the design process including interaction with the manufacturer.
Texas Instruments Sensors: Effective Solutions for All Types of Measurements DOI: 10.22184/1992-4178.2020.193.2.106.111
Texas Instruments is one of the leading companies in the development and manufacture of sensors. The article provides an overview of the main types of TI sensors for industrial applications, recent company innovations, as well as examples of solutions based on them.
Automated EMC test systems based on R&S ELEKTRA software platform DOI: 10.22184/1992-4178.2020.193.2.70.75
The article considers the structure of automated systems for EMC testing based on R&S ELEKTRA software from Rohde & Schwarz. It presents various examples of such systems.
High-Tech Industrial Product Software Certification DOI: 10.22184/1992-4178.2020.193.2.76.79
The software and hardware complex has been created for simulation and certification of software, which allows you to develop requirements for analyzing equipment, vibration-based diagnostic methods and diagnostic software.
Some issues of modern metrology in microelectronics DOI: 10.22184/1992-4178.2020.193.2.80.91
With ICs scaling and 3D-structures development metrological and test instruments become more complicated. Artificial intelligence, machine learning and computing technology enhancement play an important role in their further development and improvement.
Designing multi-chip modules and systems in package DOI: 10.22184/1992-4178.2020.193.2.144.150
Designing modern high-density packages, multi-chip modules and systems in package has a number of key features related to both the creation of the design and topology of the future product, and the transfer of product-related data to manufacturing.
Dielectric resonator based oscillators. Part 1 DOI: 10.22184/1992-4178.2020.193.2.114.128
The article considers oscillators based on dielectric resonators. It provides the information on the main characteristics, features and methods of computation of these devices.
Experimental verification of electrical connections diagnostic control method DOI: 10.22184/1992-4178.2020.193.2.92.98
The article considers the design process for the simulator of printed conductor’s latent defects to confirm the consistency of the method for detecting such defects and verify the prototype of diagnostic control device that implements this method.
The article proposes a standard method, which is developed based on specific features of the design and manufacture of electronic components. It regulates the main provisions of the methodology for the accelerated evaluation of electronic components for their compliance with the reliability requirements of performance specifications.
Ultrasonic micro bonding of large diameter wire leads in high-power semiconductor devices mounting DOI: 10.22184/1992-4178.2020.193.2.152.160
The article considers the criteria of selection of ultrasonic bonding parameters for power microelectronics interconnections. It describes the features of new ultrasound system for EM-4341 bonding machine and its main characteristics.
The use of selective soldering for the manufacture of complex small-scale products DOI: 10.22184/1992-4178.2020.193.2.162.166
The article discusses the use of selective soldering technology for the manufacture of complex small-scale products. It presents the arguments to rebut a number of misconceptions impeding the selection and implementation of this technology.