TO FULFILL ADVANCED AND CRITICAL ORDERS, WE PAY SPECIAL ATTENTION TO UPGRADING OUR MEANS OF PRODUCTION DOI: 10.22184/1992-4178.2026.255.3.18.24
TODAY, THE FIRST PRIORITY IS TO MAINTAIN DEMAND FOR DOMESTIC TECHNOLOGICAL EQUIPMENT DOI: 10.22184/1992-4178.2026.255.3.26.30
THE PRINTED CIRCUIT BOARD – THE KEY FOUNDATION OF DIGITAL REALITY DOI: 10.22184/1992-4178.2026.255.3.32.36
CREATION OF STANDARDIZED RANGES OF DRIVES – FROM CONCEPT TO DELIVERY TO THE CUSTOMER VISIT TO INNODRIVE LLC DOI: 10.22184/1992-4178.2026.255.3.62.68
NEW FACETS OF EFFICIENCY: TECHNOLOGIES OF THE FUTURE AND GROWTH STRATEGIES FOR RUSSIAN ELECTRONICS ENTERPRISES ALL-RUSSIAN INDUSTRY CONFERENCE “WORLD-CLASS MANUFACTURING – 2026”. PART 2 DOI: 10.22184/1992-4178.2026.255.3.56.60
MICROELECTRONICS LABOR MARKET ANALYSIS: CHALLENGES OF STAFFING DOI: 10.22184/1992-4178.2026.255.3.74.78
The article presents the results of monitoring the labor market at enterprises in the microelectronics industry, conducted by the Basic Center for Training Personnel for Microelectronics in 2025.
ON METHODOLOGICAL APPROACHES TO MONITORING THE STAFFING OF MICROELECTRONICS ENTERPRISES IN DYNAMICS Assessing the current state of staffing at microelectronics companies allows for the timely identification of imbalances and improved predictability of the industry’s workforce needs. The article presents methodological approaches to organizing systematic monitoring
of staffing at companies in the Russian microelectronics industry.
INELSO: ELECTRONIC AND ELECTROMECHANICAL COMPONENTS FOR AUTOMOTIVE APPLICATIONS The article examines INELSO’s offerings of components for automotive on-board control electronics, safety systems, driver assistance systems, autonomous control systems
and electric actuator assemblies.
THE UMKA AUTOMATIC DIE MOUNTING SYSTEM – DESIGNED AND MANUFACTURED IN RUSSIA DOI: 10.22184/1992-4178.2026.255.3.140.144
Developed and manufactured by specialists at Sovtest ATE LLC, the UMKA semiconductor die mounting system is a completely Russian development that meets the highest industry requirements for precision, versatility, and support for established mounting technologies.
HIGH-PRECISION ASSEMBLY OF OPTICAL COMPONENTS IN LASER SYSTEMS DOI: 10.22184/1992-4178.2026.255.3.146.152
The article discusses the main methods of high precision mounting of optical components, describes the challenges of manual and automated assembly of laser systems, and outlines
the requirements for automated equipment.
SOFTWARE FOR AN AUTOMATED WIRE LAYOUT SYSTEM DOI: 10.22184/1992-4178.2026.255.3.154.156
A machine system for automated wire routing and harness handling was developed and implemented, comprising three specialized machines. The system’s software features a modular
architecture and was created using open-source software tools and computer vision algorithms.
MODERN DOMESTIC OPERATIONAL AMPLIFIERS FROM NZPP VOSTOK JSC: TRADITIONS OF QUALITY AND NEW TECHNOLOGICAL SOLUTIONS DOI: 10.22184/1992-4178.2026.255.3.126.130
The article presents the status of development at NZPP Vostok JSC in the field of operational amplifiers, tracing the evolution of components from analog device elements to high-tech solutions in plastic packages designed for operation in extreme temperature conditions.
“LABSPHERA” LIMS BY IC SOCKET – СOMPREHENSIVE DIGITALIZATION OF MICROELECTRONICS TESTING LABORATORIES A laboratory information management system (LIMS) has been developed to automate complex operations, reduce human errors, ensure full traceability of test objects, improve overall laboratory productivity and guarantee data protection in accordance with international and national standards.
ENGINEERING ETHICS IN CUSTOMER-SUPPLIER RELATIONSHIPS Given the limited supply of products from global manufacturers, it is important for Russian companies to ensure timely access to advanced microelectronic device packaging solutions. The article describes the interactions between the customer and supplier during the approval of the technical specifications and contract for the supply of packages for microelectronics.
INDUCTIVELY COUPLED PLASMA MASS SPECTROMETRY AS AN EFFECTIVE METHOD FOR MONITORING THE PURITY OF MATERIALS IN MICROELECTRONIC PRODUCTION The article discusses the method of inductively coupled plasma mass spectrometry, which allows for highly sensitive quantitative and qualitative analysis of impurities of most metals
and a number of non-metals in chemicals, special gases and semiconductor structures used in microelectronic production.
APPLICATION OF PHOTON EMISSION MICROSCOPY FOR QUALITY CONTROL AND FAILURE ANALYSIS OF ICs The article presents an overview of the physical mechanisms of photon generation in semiconductor structures, describes the main operating modes of PEM systems, and describes the method’s capabilities for localizing various types of defects. Practical examples of the method’s application in microelectronics development and production are provided.
DOMESTIC MPW TECHNOLOGY SERVICE – OPPORTUNITIES FOR EDUCATION AND INDUSTRY DOI: 10.22184/1992-4178.2026.255.3.88.95
The domestic MPW technology service addresses the important task of engaging students in practical activities directly related to domestic technologies and production, as well as providing
the industry with qualified personnel. The article examines the key elements and areas of the service, analyzes the results achieved and outlines development plans.
UNIVERSITIES IN THE RACE FOR TECHNOLOGICAL LEADERSHIP: FOCUSING ON TALENT AND NEW TECHNOLOGIES DOI: 10.22184/1992-4178.2026.255.3.96.99
The article describes the «Electronics and Unmanned Technologies» industrial cluster, created in the Tomsk region and uniting education, technological development and industry. It comprises
13 organizations, including the specialized university, TUSUR. Cluster members implement joint high-tech projects, bring ideas
and prototypes to deployment and participate in the development
of educational programs.
ENGINEERING WORKFORCE DEVELOPMENT: FROM SCHOOL TO THE WORKPLACE DOI: 10.22184/1992-4178.2026.255.3.100.102
The article presents a project for establishing educational and research centers (ERC) within universities that implement educational programs in close collaboration with industrial enterprises. This project is part of a strategy to form a research and industrial cluster that integrates the efforts of mass-production and technology-innovation facilities, ERCs at universities, design centers and industrial partners.
INDUSTRY AND EDUCATION: THE FORMULA FOR WINNING IN THE FIGHT FOR PERSONNEL BY THE EXAMPLE OF ZPP JSC DOI: 10.22184/1992-4178.2026.255.3.104.106
Cooperation and partnership between manufacturing companies and educational institutions allows businesses to address their talent needs by acquiring trained specialists, while educational institutions, in turn, provide students with internships
and employment opportunities. The effectiveness
of such cooperation is demonstrated by the example of ZPP JSC.
HUMAN RESOURCES SOVEREIGNTY IN AN ERA OF LABOR MARKET SHORTAGES: HOW TO STOP COMPETING ON SALARIES AND START COMPETING ON MEANING DOI: 10.22184/1992-4178.2026.255.3.108.112
The challenges of managing human resources in a highly competitive labor market affect virtually all categories of companies in the electronics industry. Based on an understanding
of psychological mechanisms and an analysis of best international practices, MikroEM Technologies formulated five principles of HR policy. Recommendations for the application
of this methodology are provided.
MICROELECTRONICS STAFFING IN THE US The article analyzes the impact of the CHIPS Act (Creating Helpful Incentives to Produce Semiconductors for America Act) on staffing
in the US microelectronics industry.
LTCC TODAY AND THE TECHNOLOGY DEVELOPMENT TRENDS The article examines the current state of LTCC technology as an industrially mature platform for the production of multilayer ceramic modules. It also analyzes the factors determining
the technology’s relevance in the next decade and the main areas of its development.
SILICON CARBIDE FOR POWER ICs: FABRICATION OF WAFERS WITH EPITAXIAL LAYERS The paper describes the first three stages of the silicon carbide-based integrated circuit manufacturing cycle: single crystal growth, wafer fabrication and epitaxy. An overview of current technological solutions and equipment used at these stages is presented.
REVERSE ENGINEERING OF MODERN ICs Reverse engineering is the process of analyzing chip to understand its design, structure and functionality. The article discusses modern methods and trends of reverse engineering in microelectronics.
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