rus
Competent opinion
S. Musaev
THERE ARE NO UNMANAGEABLE ISSUES. WE JUST NEED TO WORK TOGETHER DOI: 10.22184/1992-4178.2025.252.10.12.16
THERE ARE NO UNMANAGEABLE ISSUES. WE JUST NEED TO WORK TOGETHER DOI: 10.22184/1992-4178.2025.252.10.12.16
S. Belousov
AI PLATFORM HELPS OPTIMIZE MICROELECTRONIC PRODUCTION DOI: 10.22184/1992-4178.2025.252.10.18.20
AI PLATFORM HELPS OPTIMIZE MICROELECTRONIC PRODUCTION DOI: 10.22184/1992-4178.2025.252.10.18.20
Column of radio-electronic industry department
Report from a company
Yu. Kovalevsky
LOCALIZATION STEP BY STEP: A NEW SITE FOR MANUFACTURING OF DOMESTIC BASE MATERIALS FOR BARE BOARDS PRODUCTION. VISIT TO THE PRODUCTION FACILITY OF VINTECH LCC DOI: 10.22184/1992-4178.2025.252.10.68.76
LOCALIZATION STEP BY STEP: A NEW SITE FOR MANUFACTURING OF DOMESTIC BASE MATERIALS FOR BARE BOARDS PRODUCTION. VISIT TO THE PRODUCTION FACILITY OF VINTECH LCC DOI: 10.22184/1992-4178.2025.252.10.68.76
Company Profile
Sh. Shugaev, R. Akhmetgaliev, V. Egoshin, S. Prudnikov
ZPP JSC – 85TH YEAR AT THE PACE OF TECHNOLOGY DOI: 10.22184/1992-4178.2025.252.10.78.82
ZPP JSC – 85TH YEAR AT THE PACE OF TECHNOLOGY DOI: 10.22184/1992-4178.2025.252.10.78.82
Exhibitions & Conferences
TECHNOLOGIES, MATERIALS AND EQUIPMENT FOR THE PRODUCTION OF PASSIVE ELECTRONIC COMPONENTS A ROUNDTABLE DISCUSSION AS PART OF THE BUSINESS PROGRAM OF THE RUSSIAN FORUM “MICROELECTRONICS 2025”
DOI: 10.22184/1992-4178.2025.252.10.46.52
Yu. Kovalevsky
ADVANCEMENT IN DOMESTIC TECHNOLOGIES FOR THE BARE BOARDS PRODUCTION “RUSCON 2025” RESEARCH AND PRACTICE CONFERENCE DOI: 10.22184/1992-4178.2025.252.10.54.60
ADVANCEMENT IN DOMESTIC TECHNOLOGIES FOR THE BARE BOARDS PRODUCTION “RUSCON 2025” RESEARCH AND PRACTICE CONFERENCE DOI: 10.22184/1992-4178.2025.252.10.54.60
E. Kasparova
CURRENT TRENDS AND ADVANCED TECHNOLOGIES IN PRINTED CIRCUIT BOARD ASSEMBLY AND MICROELECTRONICS MANUFACTURING “GLOBAL TECHNOLOGY – GT 2025” TECHNICAL CONFERENCE DOI: 10.22184/1992-4178.2025.252.10.62.67
CURRENT TRENDS AND ADVANCED TECHNOLOGIES IN PRINTED CIRCUIT BOARD ASSEMBLY AND MICROELECTRONICS MANUFACTURING “GLOBAL TECHNOLOGY – GT 2025” TECHNICAL CONFERENCE DOI: 10.22184/1992-4178.2025.252.10.62.67
Information and telecommunication systems
V. Nenashev, V. Kuzmenko, S. Soleny
METHOD FOR COMBINING RADAR VIDEO FRAMES WITH A VIRTUAL TERRAIN MODEL IN A GROUP OF SMALL-SIZED AIRBORNE RADARS Timely acquisition of terrain video information in low visibility conditions is essential for various missions today. The article presents a method for merging radar video frames with a virtual terrain model in an interacting group of small airborne radars.
METHOD FOR COMBINING RADAR VIDEO FRAMES WITH A VIRTUAL TERRAIN MODEL IN A GROUP OF SMALL-SIZED AIRBORNE RADARS Timely acquisition of terrain video information in low visibility conditions is essential for various missions today. The article presents a method for merging radar video frames with a virtual terrain model in an interacting group of small airborne radars.
Tags: airborne radar cluster correlation algorithm radar video frames video information virtual terrain model бортовая рлс видеоинформация виртуальная модель местности кластерно-корреляционный алгоритм радиолокационные видеокадры
Manufacturing equipment and process materials
Yu. Koval, V. Volkov
LOCALIZATION OF PRODUCTION OF THE SOLO VKS M PLANETARY MIXER DOI: 10.22184/1992-4178.2025.252.10.86.91
Work on localizing the production of the Solo VKS M laboratory mixer in Russia
has been completed. Now, the mixer, designed for mixing sealants, compounds, vixants and adhesives, consists primarily of home made components.
LOCALIZATION OF PRODUCTION OF THE SOLO VKS M PLANETARY MIXER DOI: 10.22184/1992-4178.2025.252.10.86.91
Work on localizing the production of the Solo VKS M laboratory mixer in Russia
has been completed. Now, the mixer, designed for mixing sealants, compounds, vixants and adhesives, consists primarily of home made components.
Tags: compounds design mixer mixing sealants vixants виксинты герметики компаунды конструкция миксер смешивание
A. Ivanov
SOLINT – MODERN FLUXES FOR RELIABLE AUTOMATED AND MANUAL SOLDERING DOI: 10.22184/1992-4178.2025.252.10.92.94
The article examines the key characteristics and classification
of fluxes used in electronics manufacturing. Information
about the new SOLINT flux line for through-hole and manual assembly from Solidus is also presented.
SOLINT – MODERN FLUXES FOR RELIABLE AUTOMATED AND MANUAL SOLDERING DOI: 10.22184/1992-4178.2025.252.10.92.94
The article examines the key characteristics and classification
of fluxes used in electronics manufacturing. Information
about the new SOLINT flux line for through-hole and manual assembly from Solidus is also presented.
Tags: corrosivity сопротивление изоляции insulation resistance no-clean flux organic flux resin flux rosin-based flux water-soluble flux безотмывочный флюс водосмываемый флюс канифольный флюс коррозионная активность органический флюс синтетический флюс
A. Filipchenko
VIKING INDUSTRIAL FURNITURE: HIGH-QUALITY DOMESTIC SOLUTIONS FOR ELECTRONIC MANUFACTURING DOI: 10.22184/1992-4178.2025.252.10.96.98
Industrial furniture production established by DIPOL-Proizvodstvo meets global standards and is characterized by a high degree of localization, ensuring independence from foreign suppliers.
The article presents technological solutions under the VIKING brand that are competitive with foreign counterparts.
VIKING INDUSTRIAL FURNITURE: HIGH-QUALITY DOMESTIC SOLUTIONS FOR ELECTRONIC MANUFACTURING DOI: 10.22184/1992-4178.2025.252.10.96.98
Industrial furniture production established by DIPOL-Proizvodstvo meets global standards and is characterized by a high degree of localization, ensuring independence from foreign suppliers.
The article presents technological solutions under the VIKING brand that are competitive with foreign counterparts.
Tags: антистатическое оборудование вытяжные шкафы ламинарные боксы локализация производства промышленная мебель шкафы сухого хранения
Test & Measurements
L. Chelyshev
DEVELOPMENT OF VERIFICATION ALGORITHM AND ANALYSIS OF THE OPERATIONAL CHARACTERISTICS OF DIGITAL MEMS ACCELEROMETERS UNDER STATIC CONDITIONS The article proposes an algorithm for testing and verifying MEMS accelerometers and analyzes the results of studying sensor samples under static conditions using the developed automated testing system.
DEVELOPMENT OF VERIFICATION ALGORITHM AND ANALYSIS OF THE OPERATIONAL CHARACTERISTICS OF DIGITAL MEMS ACCELEROMETERS UNDER STATIC CONDITIONS The article proposes an algorithm for testing and verifying MEMS accelerometers and analyzes the results of studying sensor samples under static conditions using the developed automated testing system.
Tags: allan error axis covariance and correlation digital mems accelerometers standard deviation verification algorithm алгоритм проверки ковариация и корреляция осей отклонение аллана стандартное отклонение цифровые мэмс-акселерометры
Microwave electronics
K. Dzhurinsky, A. Androsova
RF CONNECTORS AND CABLE ASSEMBLIES AT THE 27TH EUROPEAN MICROWAVE WEEK. PART 2 DOI: 10.22184/1992-4178.2025.252.10.106.109
The article examines the cutting-edge achievements of several international companies in the field of microwave connectors, cables and cable assemblies. The first part of the article considers polymer RF connectors from Corning and cable assemblies from SV Microwave and Smiths Interconnect.
RF CONNECTORS AND CABLE ASSEMBLIES AT THE 27TH EUROPEAN MICROWAVE WEEK. PART 2 DOI: 10.22184/1992-4178.2025.252.10.106.109
The article examines the cutting-edge achievements of several international companies in the field of microwave connectors, cables and cable assemblies. The first part of the article considers polymer RF connectors from Corning and cable assemblies from SV Microwave and Smiths Interconnect.
Reliability and tests
O. Chuprinova
MODEL FOR ASSESSING THE IMPACT OF COMPONENT OVERHEATING ON THE RELIABILITY OF A PRINTED-BOARD ASSEMBLY Overheating of printed-board assembly is one of the key factors leading to premature failures. The article assesses the impact of component overheating on PCB reliability. The calculations
are based on a modified Arrhenius equation adapted for electronic components.
MODEL FOR ASSESSING THE IMPACT OF COMPONENT OVERHEATING ON THE RELIABILITY OF A PRINTED-BOARD ASSEMBLY Overheating of printed-board assembly is one of the key factors leading to premature failures. The article assesses the impact of component overheating on PCB reliability. The calculations
are based on a modified Arrhenius equation adapted for electronic components.
Tags: arrhenius rule component overheating degradation processes printed-board assembly деградационные процессы перегрев компонентов печатный узел правило аррениуса
M. Gubin
AUTOMATED NON-DESTRUCTIVE TESTING DEVICE The article presents an automated device for non-destructive testing of coating quality on complex geometrically shaped products.
It is designed to detect surface defects and measure the thickness of the protective coating applied to the inner wall of these products.
AUTOMATED NON-DESTRUCTIVE TESTING DEVICE The article presents an automated device for non-destructive testing of coating quality on complex geometrically shaped products.
It is designed to detect surface defects and measure the thickness of the protective coating applied to the inner wall of these products.
Tags: complex geometrically shaped products magnetic and eddy current testing изделия сложной геометрической формы магнитный и вихретоковый контроль
for Engineers
Production technologies
G. Savushkin
CURRENT FLIP-CHIP PACKAGING TECHNOLOGIES DOI: 10.22184/1992-4178.2025.252.10.100.104
Flip-chip packaging is a key technology for packaging modern highly integrated ICs, systems-on-chip (SoCs) and microassemblies. The article provides an overview of the main technologies
used today in flip-chip packaging
CURRENT FLIP-CHIP PACKAGING TECHNOLOGIES DOI: 10.22184/1992-4178.2025.252.10.100.104
Flip-chip packaging is a key technology for packaging modern highly integrated ICs, systems-on-chip (SoCs) and microassemblies. The article provides an overview of the main technologies
used today in flip-chip packaging
Tags: bonding with non-conductive adhesive c4 bumps electroplating flip-chip technology flip-chip-технология gold stud bumps thermal-sonic bonding thermocompression bonding wire bonding бампы из золота бампы типа c4 гальваническое осаждение монтаж на непроводящий адгезив проволочный монтаж термозвуковой монтаж термокомпрессионный монтаж
Annual Issue