rus
Issue #10/2025
O. Chuprinova
MODEL FOR ASSESSING THE IMPACT OF COMPONENT OVERHEATING ON THE RELIABILITY OF A PRINTED-BOARD ASSEMBLY
MODEL FOR ASSESSING THE IMPACT OF COMPONENT OVERHEATING ON THE RELIABILITY OF A PRINTED-BOARD ASSEMBLY
DOI: 10.22184/1992-4178.2025.252.10.120.122
Overheating of printed-board assembly is one of the key factors leading to premature failures. The article assesses the impact of component overheating on PCB reliability. The calculations
are based on a modified Arrhenius equation adapted for electronic components.
Tags: arrhenius rule component overheating degradation processes printed-board assembly деградационные процессы перегрев компонентов печатный узел правило аррениуса
Subscribe to the journal Electronics: STB to read the full article.
Overheating of printed-board assembly is one of the key factors leading to premature failures. The article assesses the impact of component overheating on PCB reliability. The calculations
are based on a modified Arrhenius equation adapted for electronic components.
Tags: arrhenius rule component overheating degradation processes printed-board assembly деградационные процессы перегрев компонентов печатный узел правило аррениуса
Subscribe to the journal Electronics: STB to read the full article.
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