II Scientific-practical seminar on the application of electronic components and materials in special-purpose radio-electronic equipment
Creation of multi-functional and multi-project prototyping platform based on Synopsys HAPS kit Part 2
The article considers the software infrastructure for functional verification testing and execution of user scripts on the prototype.
New components and solutions from Würth Elektronik: fewer and fewer space for "magic" in electronics
Mentor, a Siemens Business solutions for IC and PCB design Part 1
The article provides a brief information about all IC and PCB design tools from Mentor Graphics. The first part presents tools for design, simulation and verification of digital, analog and analog-digital integrated circuits.
Multichannel measuring system based on high-resolution small-sized spectrometers Studies of modern plasma technology require the development of new measurement processes. The proposed multichannel measuring system based on small-sized spectrometers allows spectral analysis of both stationary and fast-flowing processes with non-stationary temperature.
4,5 months from micromodule idea to finished sample NPC SES and OKB Fifth Generation project,
presented at ExpoElectronica 2019
Particular aspects of the application of SMP-type coaxial-to-microstrip transitions for surface mounting The article considers some technical aspects of the application and measurement of microwave coaxial-to-microstrip transitions for surface mounting using the example of a connector from Irkutsk Relay Plant JSC.
Methods to increase the resistance of SRAM based FPGA to the effects of ionizing radiation With the continuous shrinking of technological design rules the errors caused by radiation began to have a significant impact on large-scale IC reliability. The article presents the main hardware and software methods to protect modern SRAM based FPGA from the effects of failures caused by ionizing radiation.
Increasing reliability and yield: traditional and new approaches With scaling microelectronic technologies and mastering the production of new generation devices the task of increasing the yield becomes more and more urgent. To increase reliability and yield manufacturers constantly improve current metrology and test methods as well as create new ones.
Industry laboratory of testing and nano-diagnostics of special-technology equipment (OLIN STO) The article describes the organizational chart, goals, objectives and equipment of the industry laboratory of testing and nano-diagnostics of special-technology equipment organized at KBTEM-OMO JSC.
Specifics of testing for resistance to mold fungi The article considers the issues of product resistance to the impact of external environment in particular destructor microorganisms. It reveals the typical problems caused by the growth of mold fungi on various products and materials. It also discusses standardization documents regulating the requirements of resistance to mold fungi as well as the methods for performing such tests.
HIRF resistance tests EMC laboratory of TESTPRIBOR JSC is conducting tests of on-board equipment for resistance to HIRF fields in accordance with KT-160 standard using the calculation and experimental method. The reverberation chamber is currently undergoing certification. Upon its completion a full range of KT-160 standard HIRF resistance tests will be carried out.
EMC testing systems for integrated circuits and printed circuit boards The article considers devices and systems from Langer EMV-Technik (Germany) allowing various types of IC and PCB testing for electromagnetic compatibility (EMC).
Interference reduction in synchronous step-down converters with an additional Schottky diode using the example of Analog Devices ADP2443 The article describes the method for minimizing interference in synchronous step-down (buck) converter circuit based on Analog Devices ADP2443 switching regulator.
PCB strain evaluating The article considers the method for quantitatively evaluating the dimensional PCB strain which could be used after any stage of technological process and on the basis of its results take action to keep the strain within the tolerance for the PCB of this accuracy class.