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Long-term storage and conservation of electronic components at TESTPRIBOR JSC The article discusses the problems arising from the long-term storage of electronic components. It describes solutions used by TESTPRIBOR JSC to keep electronic components in working condition for a long time.
Digital temperature sensors with integrated EEPROM memory: features and benefits Microchip's digital temperature sensors with integrated EEPROM memory provide accurate temperature measurement and allow you to record product usage data throughout the product’s life cycle. The article discusses the features and benefits of this effective solution for a wide range of applications.
Cree power LEDs The article reviews SC5 technology as well as the characteristics of XHP and J series high-power LEDs. Thanks to unique technologies of semiconductor material production, Cree products feature high electrical characteristics and reliability.
PacTech laser soldering and packaging technology PacTech offers advanced equipment for laser based wafer level mounting and soldering of microcomponents as well as services for substrate/wafer level bumping and packaging. The article reviews the technological principles implemented in PacTech’s equipment, advanced platforms and services offered by the company.
DragonFly 3D printer is a revolutionary solution for production of multi-layer printed circuit boards The article considers DragonFly 3D printer designed for production of multi-layer printed circuit boards. It is noted that the emergence of the printer has opened up a number of new opportunities for prototyping and manufacture of electronic products.
DARE65T radiation-hardened space SoC design platform DARE65T SoC design platform provides low power, high density VLSI as well as high TID and SEL hardness. The article considers methods for improving the radiation hardness of designed VLSIs implemented in the platform as well as its main parameters and functional features.
Current trends in the development of microelectronics. Part 1 The article considers the challenges faced by modern microelectronics: the correlation between the development of up-to-date electronics and the state of the global economy, the scaling technology does not meet the requirements of the further development of electronics, increasing IC complexity.
Solid state and organic micro-LEDs – technology, market, prospects The article considers various problems of the technology and the market of micro-LEDs which are 20–50 µm solid-state light emitters. Micro-LED technology is compared with other types of display technology. In the coming years a 50-fold gain in micro-LED production volume is expected.
Product as a service in the era of the fourth industrial revolution The article describes the principles of the “product as a service” business model and the ways of transition to this model in the current context, the problems of smart devices’ creation, new approaches to the interaction between the manufacturer and the customer in the era of economy digitalization.
Car radars for 24- and 77-GHz frequency bands The article considers car radars for 24- and 77-GHz frequency bands from PKK Milandr JSC integrated into advanced driver-assistance system (ADAS), which will significantly reduce the number of accidents on Russian roads.
Analysis of technologies of PCB hole direct metallization. Part 1 The article analyzes shortcomings of the technology of printed circuit board holes metallization using chemical copper plating, which made it necessary to search for alternative methods of metallization. An overview of the main technologies of direct metallization using palladium activator is given.
Hardware method to prevent hole defects in printed circuit boards The article proposes the method and the device that implementing it to prevent defects when drilling holes in printed circuit boards. Axial force of the drill feed is used in the device to determine its current temperature and to stop the equipment operation when the temperature exceeds a certain accepted value.
High-voltage thyristors with self-protection elements when operating in emergency states The article reviews the method of local proton irradiation of the area of the main control thyristor electrode. Irradiation is used to the formation of built-in self-protection elements against overvoltage in high-voltage semiconductor thyristors.
CoolMOS P7 MOSFET family: the optimal solution from Infineon for a wide range of applications The article presents an overview of new high-voltage Infineon CoolMOS P7 MOSFET family featuring an optimal combination of efficiency and price and providing ease of use in circuits of different topologies.
Flex Power Modules is a new name and technology on the Russian market of modular DC/DC converters Flex Power Modules (Flex) products are widely used in telecom equipment, data processing and storage systems (including supercomputers and cryptographic equipment) and are in demand in the industrial and transport segments.
Metal-ceramic packages’ development trends The article reviews main trends in the development of metal-ceramic packages. Examples of metal-ceramic packages developed by ZPP JSC on the basis of these trends are given.