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Issue #8/2025
M. Makushin
Some Aspects of the Development of IC Testing and Verification Methodologies
Some Aspects of the Development of IC Testing and Verification Methodologies
DOI: 10.22184/1992-4178.2025.250.8.30.40
With the adoption of ever smaller design rules, the increasing
use of 3D designs and heterogenous (with diverse design rules
and functionality) multi-chip/multi-chiplet modules, the need
for new verification methods arises.
Keywords: artificial intelligence, machine learning,
automation, testing methods
Subscribe to the journal Electronics: STB to read the full article.
With the adoption of ever smaller design rules, the increasing
use of 3D designs and heterogenous (with diverse design rules
and functionality) multi-chip/multi-chiplet modules, the need
for new verification methods arises.
Keywords: artificial intelligence, machine learning,
automation, testing methods
Subscribe to the journal Electronics: STB to read the full article.
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