THE “STORAGE” STAGE IS ON THE WAY TO FULL RECOGNITION AS A DISTINCT PHASE WITHIN THE LIFE CYCLE OF TRUSTED ELECTRONIC COMPONENTS The article analyzes the challenges of regulatory support for the storage of finished products at manufacturer warehouses. It substantiates the need to regulate storage as a distinct stage in the lifecycle of electronic component base, as well as modern electrical products.
ELECTRONICS IS THE ASSEMBLAGE POINT OF THE NEW GLOBAL ORDER The article discusses conceptual approaches for creating a model for strategic planning and management of the domestic electronics industry based on digitalization, which contributes to increased production efficiency and the industry's advancement to a new technological level.
RISC-V BASED MICROCONTROLLER FOR UNINTERRUPTIBLE POWER SUPPLY APPLICATIONS DOI: 10.22184/1992-4178.2026.260.7.52.56
The article presents a new development from PKK Milandr JSC – MDR1218FI 32 bit microcontroller based on RISC-V, which is intended for use in uninterruptible power supply devices.
DUAL-CORE 64 BIT APPLICATION PROCESSOR WITH AN ISOLATED 32 BIT AUXILIARY CORE BASED ON RISC-V PKK Milandr JSC has added a new chip to its portfolio: the MDR1101GI application processor. This new development is designed for modern embedded solutions, such as network devices, industrial and home automation controllers and data collection and transmission devices. The article introduces readers to the features and key applications of the new processor.
GALLIUM NITRIDE-BASED POWER ELECTRONICS: A CHIP PRODUCTION MODERNIZATION PROJECT DOI: 10.22184/1992-4178.2026.260.7.96.103
The article discusses key aspects of equipping a modern die production facility for gallium nitride semiconductor devices on 200 mm diameter wafers. Key technological areas are analyzed: liquid processes, plasma etching and deposition of films, vapor-phase metal deposition (PVD) and ion implantation. Particular attention is paid to the specific requirements of GaN HEMT manufacturing technology.
TIME-TESTED, BUT TIME TESTS AGAIN: ELTRIN U1 AND NEW STANDARDS OF WATER PROTECTION DOI: 10.22184/1992-4178.2026.260.7.104.110
The article examines the technological advantages of using single-component polyurethane moisture-protective coatings in electronics manufacturing, featuring the Eltrin U1 varnish, developed by Ostec-Integra LLC. The results of Eltrin U1 qualification tests conducted in the company's in-house laboratory and at specialized research centers are presented.
EXPERIMENTAL AND ANALYTICAL ASSESSMENT OF THE CONCENTRATION AND DISPERSED COMPOSITION OF SOLDER SLAG AEROSOL DURING SELECTIVE SOLDERING DOI: 10.22184/1992-4178.2026.260.7.120.126
The study determines the concentrations of components and the dispersed composition of solder slag aerosol generated during selective wave soldering. It was found that the average lead concentration exceeds the occupational exposure limit by a factor of 2,64. The obtained results allow for a well-founded approach to assessing professional risks and designing local ventilation systems.
SCHEMATIC SIMULATION OF A PASSIVE MEMRISTOR-BASED CROSSBAR USING LTSPICE Developing neuromorphic systems based on memristor structures requires creating an optimal memristor model that most accurately describes the resistance switching mechanism and takes into account the actual device characteristics. The article discusses the results of circuit simulations of a passive crossbar and integrator using various memristor models in LTspice.
HOME APPLIANCE CONTROL SYSTEM BASED ON AUTONOMOUS COMPUTING NODES The article proposes and formalizes an architecture for a distributed home appliance control system based on autonomous computing nodes.
RECOGNITION OF UNMANNED AERIAL VEHICLES VIA MICRO-DOPPLER SPECTROGRAMS: THEORETICAL ASPECTS, PRACTICAL IMPLEMENTATION AND INTEGRATION PROSPECTS The article addresses the challenge of identifying small-sized UAVs amidst clutter and the need to reliably distinguish them from biological objects. A practical implementation of a compact, multifunctional radar station is proposed, along with prospects for its integration into facility security systems.
THE ADVANCED PACKAGING MARKET: HOW AI IS CHANGING THE MICROELECTRONICS INDUSTRY. PART 1 DOI: 10.22184/1992-4178.2026.260.7.130.136
The article analyzes key trends in the electronic component packaging market amid the rapid development of artificial intelligence and high-performance computing (HPC) systems. The segments of 2.5D RDL interposers, mold interposers, 3D packaging of optical modules, 3D CBA DRAM, etc. are considered.
SVEM ELECTROMECHANICAL VIBRATION TEST SYSTEMS FOR SIMULATING TRANSPORTATION-INDUCED LOADS Sovtest ATE has developed a vibration test system designed to simulate the mechanical loads encountered during equipment transportation. The article presents the key specifications of the systems and describes the control system featuring an integrated feedback loop.
WANJIE'S SWITCHING SOLUTIONS FOR HOME APPLIANCES AND CIVILIAN ELECTRONICS DOI: 10.22184/1992-4178.2026.260.7.62.65
Founded in 1992, Wanjie Electronic is China's largest manufacturer of terminal blocks and clamps for a variety of applications. The article provides an overview of Wanjie's main product categories for civilian electronics.
BGA COMPONENT REBALLING: HOW TO PRECISELY RESTORE TERMINAL GEOMETRY DOI: 10.22184/1992-4178.2026.260.7.112.118
The article examines the main reballing methods, the fundamental stages and the equipment required for the process. It presents an assessment of the quality of solder ball restoration and compares reballing methods based on experimental and calculated data.
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