rus
Issue #1/2026
I. Voznesensky
2,45 GHz MICROWAVE PLASMA: EFFECTIVE CLEANING OF GAPS IN FLIP-CHIP PACKAGES BEFORE UNDERFILLING
2,45 GHz MICROWAVE PLASMA: EFFECTIVE CLEANING OF GAPS IN FLIP-CHIP PACKAGES BEFORE UNDERFILLING
DOI: 10.22184/1992-4178.2026.253.1.58.64
The article discusses a method for cleaning flip-chip packages using microwave plasma and describes specialized microwave plasma processing equipment. A comparative analysis of this method and conventional approaches is provided, highlighting its effectiveness in cleaning narrow gaps.
Tags: flip-chip technology fluxes microwave plasma microwave plasma cleaning technology underfill андерфил свч-плазма технология flip-chip технология микроволновой плазменной очистки флюсы
Subscribe to the journal Electronics: STB to read the full article.
The article discusses a method for cleaning flip-chip packages using microwave plasma and describes specialized microwave plasma processing equipment. A comparative analysis of this method and conventional approaches is provided, highlighting its effectiveness in cleaning narrow gaps.
Tags: flip-chip technology fluxes microwave plasma microwave plasma cleaning technology underfill андерфил свч-плазма технология flip-chip технология микроволновой плазменной очистки флюсы
Subscribe to the journal Electronics: STB to read the full article.
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