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DOI: 10.22184/1992-4178.2026.253.1.66.70
A key challenge in advancing microelectronic technologies is finding reliable and gentle methods for processing materials such as SiC and GaN. The article examines the main methods
for processing semiconductor materials, including scribing, disc cutting and laser beam cutting.
Tags: disc cutting laser beam cutting scribing water jet guided laser cutting wide-bandgap semiconductors дисковая резка резка водонаправленным лазером резка лазерным лучом скрайбирование широкозонные полупроводники
Subscribe to the journal Electronics: STB to read the full article.
A key challenge in advancing microelectronic technologies is finding reliable and gentle methods for processing materials such as SiC and GaN. The article examines the main methods
for processing semiconductor materials, including scribing, disc cutting and laser beam cutting.
Tags: disc cutting laser beam cutting scribing water jet guided laser cutting wide-bandgap semiconductors дисковая резка резка водонаправленным лазером резка лазерным лучом скрайбирование широкозонные полупроводники
Subscribe to the journal Electronics: STB to read the full article.
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