rus
Issue #1/2026
Yu. Chernysheva, E. Ermolaev, V. Egoshin, Sh. Shugaepov, R. Akhmetgaliev
ZPP JSC’S SCIENTIFIC AND TECHNOLOGICAL APPROACH TO FILLING VIAS WITH METALLIZATION PASTE
ZPP JSC’S SCIENTIFIC AND TECHNOLOGICAL APPROACH TO FILLING VIAS WITH METALLIZATION PASTE
DOI: 10.22184/1992-4178.2026.253.1.72.73
The article examines ZPP JSC’s advanced approach to solving the problem of high-quality filling of small-diameter vias in IC metal-ceramic packages. This approach involves the use of metallization pastes with a high content of finely dispersed solid phase metal powder.
Tags: finely dispersed solid phase metal-ceramic packages metallization pastes vias мелкодисперсная твердая фаза металлизационные пасты металлокерамические корпуса переходные отверстия
Subscribe to the journal Electronics: STB to read the full article.
The article examines ZPP JSC’s advanced approach to solving the problem of high-quality filling of small-diameter vias in IC metal-ceramic packages. This approach involves the use of metallization pastes with a high content of finely dispersed solid phase metal powder.
Tags: finely dispersed solid phase metal-ceramic packages metallization pastes vias мелкодисперсная твердая фаза металлизационные пасты металлокерамические корпуса переходные отверстия
Subscribe to the journal Electronics: STB to read the full article.
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