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DOI: 10.22184/1992-4178.2026.254.2.136.144
The second part of the article examines some of the technological and economic challenges of creating 3D ICs: design issues, advanced packaging methods, digital twins and reliability issues.
Tags: 3d ic design mechanical stress packaging reliability корпусирование механические напряженности надежность проектирование 3d ис
Subscribe to the journal Electronics: STB to read the full article.
The second part of the article examines some of the technological and economic challenges of creating 3D ICs: design issues, advanced packaging methods, digital twins and reliability issues.
Tags: 3d ic design mechanical stress packaging reliability корпусирование механические напряженности надежность проектирование 3d ис
Subscribe to the journal Electronics: STB to read the full article.
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