rus
Issue #6/2022
A. Garanin, A. Maurin
INTERNAL ENEMY WILL NOT PASS OR HOW TO INCREASE THE RELIABILITY OF SOLDER JOINTS
INTERNAL ENEMY WILL NOT PASS OR HOW TO INCREASE THE RELIABILITY OF SOLDER JOINTS
DOI: 10.22184/1992-4178.2022.217.6.152.155
One of the most common types of defects in solder joints are voids that appear during PCB reflow. The article discusses effective methods for detecting hidden voids in solder and shows how the quality of solder joints can be significantly improved using a vacuum module built into a reflow oven.
One of the most common types of defects in solder joints are voids that appear during PCB reflow. The article discusses effective methods for detecting hidden voids in solder and shows how the quality of solder joints can be significantly improved using a vacuum module built into a reflow oven.
Теги: hidden defects reflow oven solder joint vacuum module voids x-ray system вакуумный модуль паяное соединение печь оплавления пустоты рентгеновская система скрытые дефекты
INTERNAL ENEMY WILL NOT PASS OR HOW TO INCREASE THE RELIABILITY OF SOLDER JOINTS
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