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DOI: 10.22184/1992-4178.2025.247.6.126.132
The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.
Tags: bilayer plate cte glass carrier mechanical debonding precision thinning tensile strength двуслойная пластина ктр механический дебондинг предел прочности прецизионное утонение стеклянный носитель
Subscribe to the journal Electronics: STB to read the full article.
The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.
Tags: bilayer plate cte glass carrier mechanical debonding precision thinning tensile strength двуслойная пластина ктр механический дебондинг предел прочности прецизионное утонение стеклянный носитель
Subscribe to the journal Electronics: STB to read the full article.
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