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DOI: 10.22184/1992-4178.2025.247.6.126.132
The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.
The article considers methods of precision thinning of semiconductor wafers and substantiates the expediency of using a glass substrate. The influence of elastic characteristics and thermal expansion coefficients on the deformation of a bilayer structure is analyzed, and the stresses arising during wafer dismantling are investigated to check the reliability of the glass carrier.
Теги: bilayer plate cte glass carrier mechanical debonding precision thinning tensile strength двуслойная пластина ктр механический дебондинг предел прочности прецизионное утонение стеклянный носитель
PRECISION WAFER THINNING USING GLASS INTERMEDIATE CARRIER
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