rus
Issue #2/2024
A. Egorov, E. Danilov, A. Ivanov, E. Gurova, N. Romanov, A. Gareev, Yu. Khripunova
DEVELOPMENT OF DIELECTRIC HEAT-CONDUCTING FILM ADHESIVE MATERIAL FOR THE NEEDS OF ELECTRONICS – DOMESTIC EXPERIENCE
DEVELOPMENT OF DIELECTRIC HEAT-CONDUCTING FILM ADHESIVE MATERIAL FOR THE NEEDS OF ELECTRONICS – DOMESTIC EXPERIENCE
DOI: 10.22184/1992-4178.2024.233.2.70.72
A technology has been developed for producing a dielectric heat-conducting film adhesive material for mounting aluminum and copper heat-dissipating bases of printed circuit boards.
The adhesive material is made of modified epoxy resin, hexagonal boron nitride is used as a filler.
A technology has been developed for producing a dielectric heat-conducting film adhesive material for mounting aluminum and copper heat-dissipating bases of printed circuit boards.
The adhesive material is made of modified epoxy resin, hexagonal boron nitride is used as a filler.
Теги: aerosol spraying boron nitride epoxy resin heat transfer coefficient printed circuit boards аэрозольное напыление коэффициент теплоотдачи нитрид бора печатные платы эпоксидная смола
DEVELOPMENT OF DIELECTRIC HEAT-CONDUCTING FILM ADHESIVE MATERIAL FOR THE NEEDS OF ELECTRONICS – DOMESTIC EXPERIENCE
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