rus
Issue #7/2024
I. Mandrik, I. Novozhilov
TECHNOLOGIES AND EQUIPMENT FOR TEMPORARY AND PERMANENT BONDING OF SEMICONDUCTOR WAFERS
TECHNOLOGIES AND EQUIPMENT FOR TEMPORARY AND PERMANENT BONDING OF SEMICONDUCTOR WAFERS
DOI: 10.22184/1992-4178.2024.238.7.176.181
Wafer bonding technology is increasingly used in areas such as 3D integration, packaging, ultra-thin electronic devices, and MEMS. The article provides an overview of wafer bonding technologies, discusses the key requirements and process parameters, and the equipment used.
Wafer bonding technology is increasingly used in areas such as 3D integration, packaging, ultra-thin electronic devices, and MEMS. The article provides an overview of wafer bonding technologies, discusses the key requirements and process parameters, and the equipment used.
Теги: adhesive bonding anodic wafer bonding direct wafer bonding intermediate layer wafer bonding адгезионный бондинг анодное сращивание пластин бондинг полупроводниковых пластин промежуточный слой прямое сращивание пластин
TECHNOLOGIES AND EQUIPMENT FOR TEMPORARY AND PERMANENT BONDING OF SEMICONDUCTOR WAFERS
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