rus
Issue #9/2025
Sh. Shugaepov, R. Akhmetgaliev, V. Egoshin, A. Loskutova
SINGLE-CHANNEL AND DUAL-CHANNEL DIP PACKAGES FOR THE ASSEMBLY AND SEALING OF INTEGRATED CIRCUIT DIE
SINGLE-CHANNEL AND DUAL-CHANNEL DIP PACKAGES FOR THE ASSEMBLY AND SEALING OF INTEGRATED CIRCUIT DIE
DOI: 10.22184/1992-4178.2025.251.9.76.78
The article presents the design and manufacturing technology of two standard metal-ceramic packages (MK 2101.8-8.01 and MK 2101.8-8.02) for the assembly and sealing of integrated circuit dies. These packages provide stable protection of the dies from external factors.
Subscribe to the journal Electronics: STB to read the full article.
The article presents the design and manufacturing technology of two standard metal-ceramic packages (MK 2101.8-8.01 and MK 2101.8-8.02) for the assembly and sealing of integrated circuit dies. These packages provide stable protection of the dies from external factors.
Subscribe to the journal Electronics: STB to read the full article.
Readers feedback
