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Issue #9/2021
K. Felton, D. Vertyanov, S. Evstafiev, V. Sidorenko
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS
DOI: 10.22184/1992-4178.2021.210.9.142.146
The article discusses new IC packaging solution, the digital twin concept. This is an electronic virtual model of a product being developed, which allows for integrated codesign at every stage of its development.
Tags: заказные ис многокристальная сборка системы на кристалле цифровая модель системы в корпусе
Subscribe to the journal Electronics: STB to read the full article.
The article discusses new IC packaging solution, the digital twin concept. This is an electronic virtual model of a product being developed, which allows for integrated codesign at every stage of its development.
Tags: заказные ис многокристальная сборка системы на кристалле цифровая модель системы в корпусе
Subscribe to the journal Electronics: STB to read the full article.
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