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DOI: 10.22184/1992-4178.2025.246.5.104.108
Chiplet-based systems provide a number of advantages from a design and manufacturing perspective, but at the same time require the implementation of advanced packaging and heterogeneous integration technologies. The article provides an overview of modern methods for creating interconnects in chiplet-based systems.
Tags: chiplets flexible bridge heterogeneous integration interconnects interposer packaging technologies rigid bridge through silicon vias (tsv) гетерогенная интеграция гибкий мост жесткий мост интерпозер межсоединения переходные отверстия в кремнии (tsv) технологии корпусирования чиплеты
Subscribe to the journal Electronics: STB to read the full article.
Chiplet-based systems provide a number of advantages from a design and manufacturing perspective, but at the same time require the implementation of advanced packaging and heterogeneous integration technologies. The article provides an overview of modern methods for creating interconnects in chiplet-based systems.
Tags: chiplets flexible bridge heterogeneous integration interconnects interposer packaging technologies rigid bridge through silicon vias (tsv) гетерогенная интеграция гибкий мост жесткий мост интерпозер межсоединения переходные отверстия в кремнии (tsv) технологии корпусирования чиплеты
Subscribe to the journal Electronics: STB to read the full article.
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