rus
Issue #8/2024
A. Alontsev
METHODOLOGY FOR CONDUCTING INCOMING INSPECTION OF ICs IN METAL-CERAMIC PACKAGES
METHODOLOGY FOR CONDUCTING INCOMING INSPECTION OF ICs IN METAL-CERAMIC PACKAGES
DOI: 10.22184/1992-4178.2024.239.8.68.69
The article examines the resources and competencies required to conduct incoming inspection of ICs in metal-ceramic packages, as well as the difficulties
that arise when inspecting foreign-made packages associated
with the need to focus on foreign standards.
Tags: ics incoming inspection metal-ceramic packages входной контроль металлокерамические корпуса микросхемы
Subscribe to the journal Electronics: STB to read the full article.
The article examines the resources and competencies required to conduct incoming inspection of ICs in metal-ceramic packages, as well as the difficulties
that arise when inspecting foreign-made packages associated
with the need to focus on foreign standards.
Tags: ics incoming inspection metal-ceramic packages входной контроль металлокерамические корпуса микросхемы
Subscribe to the journal Electronics: STB to read the full article.
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