rus
Issue #1/2025
V. Lelyaev
MODERN METHODS OF REMOVING CONTAMINANTS FROM SUBSTRATES IN MICROELECTRONICS
MODERN METHODS OF REMOVING CONTAMINANTS FROM SUBSTRATES IN MICROELECTRONICS
DOI: 10.22184/1992-4178.2025.242.1.64.68
The article discusses methods of liquid and dry cleaning of semiconductor substrates, features of the technological process and the equipment used.
The article discusses methods of liquid and dry cleaning of semiconductor substrates, features of the technological process and the equipment used.
Теги: chemical cleaning газовое травление отжиг плазменная очистка плазмохимическое травление подложка сухие методы очистки химическая очистка
MODERN METHODS OF REMOVING CONTAMINANTS FROM SUBSTRATES IN MICROELECTRONICS
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