rus
Issue #1/2025
V. Lelyaev
MODERN METHODS OF REMOVING CONTAMINANTS FROM SUBSTRATES IN MICROELECTRONICS
MODERN METHODS OF REMOVING CONTAMINANTS FROM SUBSTRATES IN MICROELECTRONICS
DOI: 10.22184/1992-4178.2025.242.1.64.68
The article discusses methods of liquid and dry cleaning of semiconductor substrates, features of the technological process and the equipment used.
Tags: chemical cleaning газовое травление отжиг плазменная очистка плазмохимическое травление подложка сухие методы очистки химическая очистка
Subscribe to the journal Electronics: STB to read the full article.
The article discusses methods of liquid and dry cleaning of semiconductor substrates, features of the technological process and the equipment used.
Tags: chemical cleaning газовое травление отжиг плазменная очистка плазмохимическое травление подложка сухие методы очистки химическая очистка
Subscribe to the journal Electronics: STB to read the full article.
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