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DOI: 10.22184/1992-4178.2025.247.6.134.136
Laser reballing is an innovative technology for repairing ICs in BGA packages that uses a laser for precise positioning and reliable soldering of solder balls to the BGA component package. The article describes the technological process and discusses the advantages of the method.
Tags: bga component bga-компонент : laser reballing nitrogen environment solder ball solder joint азотная среда лазерный реболлинг паяное соединение шарик припоя
Subscribe to the journal Electronics: STB to read the full article.
Laser reballing is an innovative technology for repairing ICs in BGA packages that uses a laser for precise positioning and reliable soldering of solder balls to the BGA component package. The article describes the technological process and discusses the advantages of the method.
Tags: bga component bga-компонент : laser reballing nitrogen environment solder ball solder joint азотная среда лазерный реболлинг паяное соединение шарик припоя
Subscribe to the journal Electronics: STB to read the full article.
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