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DOI: 10.22184/1992-4178.2025.247.6.134.136
Laser reballing is an innovative technology for repairing ICs in BGA packages that uses a laser for precise positioning and reliable soldering of solder balls to the BGA component package. The article describes the technological process and discusses the advantages of the method.
Laser reballing is an innovative technology for repairing ICs in BGA packages that uses a laser for precise positioning and reliable soldering of solder balls to the BGA component package. The article describes the technological process and discusses the advantages of the method.
Теги: bga component bga-компонент : laser reballing nitrogen environment solder ball solder joint азотная среда лазерный реболлинг паяное соединение шарик припоя
LASER REBALLING: HOW MODERN TECHNOLOGIES HELP IMPROVE ELECTRONICS
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