rus
Issue #4/2024
Sh. Shugaepov, E. Ermolaev, V. Egoshin, A. Gluntsov
METAL-CERAMIC PACKAGES FROM «ZPP» JSC FOR RF AND MICROWAVE DEVICES
METAL-CERAMIC PACKAGES FROM «ZPP» JSC FOR RF AND MICROWAVE DEVICES
DOI: 10.22184/1992-4178.2024.235.4.86.90
The article considers the development and production at «Semiconductor Device Plant» JSC («ZPP» JSC) of leadless metal-ceramic packages for RF and microwave devices, examples of such products are also given.
The article considers the development and production at «Semiconductor Device Plant» JSC («ZPP» JSC) of leadless metal-ceramic packages for RF and microwave devices, examples of such products are also given.
Теги: development metal-ceramic package production rf and microwave devices вч- и свч-приборы металлокерамический корпус производство разработка
METAL-CERAMIC PACKAGES FROM «ZPP» JSC FOR RF AND MICROWAVE DEVICES
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