Issue #4/2024
Sh. Shugaepov, E. Ermolaev, V. Egoshin, A. Gluntsov
METAL-CERAMIC PACKAGES FROM «ZPP» JSC FOR RF AND MICROWAVE DEVICES
METAL-CERAMIC PACKAGES FROM «ZPP» JSC FOR RF AND MICROWAVE DEVICES
DOI: 10.22184/1992-4178.2024.235.4.86.90
The article considers the development and production at «Semiconductor Device Plant» JSC («ZPP» JSC) of leadless metal-ceramic packages for RF and microwave devices, examples of such products are also given.
Tags: development metal-ceramic package production rf and microwave devices вч- и свч-приборы металлокерамический корпус производство разработка
Subscribe to the journal Electronics: STB to read the full article.
The article considers the development and production at «Semiconductor Device Plant» JSC («ZPP» JSC) of leadless metal-ceramic packages for RF and microwave devices, examples of such products are also given.
Tags: development metal-ceramic package production rf and microwave devices вч- и свч-приборы металлокерамический корпус производство разработка
Subscribe to the journal Electronics: STB to read the full article.
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