rus
Issue #8/2024
Sh. Shugaepov, V. Egoshin, E. Ermolaev, D. Taikov
THE USE OF PRECISION METHODS FOR ELECTRICAL TESTING OF METAL-CERAMIC PACKAGES
THE USE OF PRECISION METHODS FOR ELECTRICAL TESTING OF METAL-CERAMIC PACKAGES
DOI: 10.22184/1992-4178.2024.239.8.70.72
The article discusses precision testing methods implemented at Semiconductor Devices Plant JSC, which allow detecting hidden defects in metal-ceramic packages and measuring microwave characteristics of materials used to manufacture metal-ceramic packages.
Tags: electrical testing hidden defects latent testing method metal-ceramic package microwave characteristics measurement измерение свч-характеристик металлокерамический корпус метод латентного тестирования скрытые дефекты электрический контроль
Subscribe to the journal Electronics: STB to read the full article.
The article discusses precision testing methods implemented at Semiconductor Devices Plant JSC, which allow detecting hidden defects in metal-ceramic packages and measuring microwave characteristics of materials used to manufacture metal-ceramic packages.
Tags: electrical testing hidden defects latent testing method metal-ceramic package microwave characteristics measurement измерение свч-характеристик металлокерамический корпус метод латентного тестирования скрытые дефекты электрический контроль
Subscribe to the journal Electronics: STB to read the full article.
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