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DOI: 10.22184/1992-4178.2025.242.1.70.74
Decapsulation is the removal of the component package without damaging the internal structure of the product and maintaining its functionality. The article discusses modern methods of decapsulation of semiconductor devices, their advantages and disadvantages, and methods of application.
Decapsulation is the removal of the component package without damaging the internal structure of the product and maintaining its functionality. The article discusses modern methods of decapsulation of semiconductor devices, their advantages and disadvantages, and methods of application.
Теги: декапсуляция полупроводниковых приборов лазер механическое воздействие микроволновая плазма химическое травление
FOUR WAYS TO DECAPSULATE SEMICONDUCTOR DEVICES
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