rus
DOI: 10.22184/1992-4178.2025.249.7.114.118
This article describes HD TSV and hybrid bonding technologies that enable the integration of various components for sensors and imaging systems. Optimization of the thinning process
and reduction of the TSV aspect ratio eliminated electrical leakage and significantly improved TSV performance.
This article describes HD TSV and hybrid bonding technologies that enable the integration of various components for sensors and imaging systems. Optimization of the thinning process
and reduction of the TSV aspect ratio eliminated electrical leakage and significantly improved TSV performance.
Теги: 3d integration 3d-интеграция ai aspect ratio cmos structures hd tsv hybrid bonding аспектное соотношение гибридный бондинг искусственный интеллект кмоп-структуры
INTEGRATION OF A THREE-LAYER STACK: THE FUTURE OF SMART IMAGING DEVICES
Readers feedback
