rus
Issue #6/2022
Sh. Shugaepov, E. Ermolaev, V. Egoshin
FEATURES OF MULTILEAD PACKAGES PRODUCTION USING THIN CERAMIC TAPES
FEATURES OF MULTILEAD PACKAGES PRODUCTION USING THIN CERAMIC TAPES
DOI: 10.22184/1992-4178.2022.217.6.142.144
The article considers the features of the technologies for multilead packages production using thin ceramic tapes adopted by Plant of Semiconductor Devices JSC (ZPP JSC).
The article considers the features of the technologies for multilead packages production using thin ceramic tapes adopted by Plant of Semiconductor Devices JSC (ZPP JSC).
FEATURES OF MULTILEAD PACKAGES PRODUCTION USING THIN CERAMIC TAPES
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